Patents by Inventor I-CHEN CHIANG

I-CHEN CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SLURRY DISPERSION SYSTEM WITH REAL TIME CONTROL
    Publication number: 20240009803
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least large particle count (LPC) value of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the LPC value, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen CHIANG, Hwai-Te CHIU, Yi-Tsang CHEN, Chih-Chiang TSENG, Yung-Long CHEN
  • SLURRY DISPERSION SYSTEM WITH REAL TIME CONTROL
    Publication number: 20200298371
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen CHIANG, Hwai-Te CHIU, Yi-Tsang CHEN, Chih-Chiang TSENG, Yung-Long CHEN
  • Slurry dispersion system with real time control
    Patent number: 10688623
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen Chiang, Hwai-Te Chiu, Yi-Tsang Chen, Chih-Chiang Tseng, Yung-Long Chen
  • SLURRY DISPERSION SYSTEM WITH REAL TIME CONTROL
    Publication number: 20160089765
    Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
    Type: Application
    Filed: September 30, 2014
    Publication date: March 31, 2016
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: I-Chen CHIANG, Hwai-Te CHIU, Yi-Tsang CHEN, Chih-Chiang TSENG, Yung-Long CHEN
  • Systems and methods for monitoring and controlling particle sizes in slurries
    Patent number: 9159573
    Abstract: Systems and methods are provided for preparing a plurality of slurry particles. The system includes: a tank configured to contain and provide the slurry particles, a sampling module configured to sample at least one slurry particle within the tank and obtain at least one parameter related to a particle size, and a controller coupled to the tank and the sampling module, configured to vibrate the slurry particles within the tank based on the at least one parameter.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: October 13, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: I-Chen Chiang, Yung-Long Chen, Chih-Chiang Tseng, Chi-Chan Yin
  • SYSTEMS AND METHODS FOR MONITORING AND CONTROLLING PARTICLE SIZES IN SLURRIES
    Publication number: 20150170929
    Abstract: Systems and methods are provided for preparing a plurality of slurry particles. The system includes: a tank configured to contain and provide the slurry particles, a sampling module configured to sample at least one slurry particle within the tank and obtain at least one parameter related to a particle size, and a controller coupled to the tank and the sampling module, configured to vibrate the slurry particles within the tank based on the at least one parameter.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 18, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: I-CHEN CHIANG, YUNG-LONG CHEN, CHIH-CHIANG TSENG, CHI-CHAN YIN