Patents by Inventor I-Chen Chien

I-Chen Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10141479
    Abstract: A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: November 27, 2018
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: I-Chen Chien, Shih-Chang Hsu
  • Patent number: 10103291
    Abstract: A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 16, 2018
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: I-Chen Chien, Shih-Chang Hsu
  • Publication number: 20180212106
    Abstract: A method for forming a light-emitting package structure provided with a predetermined view angle is provided. The method includes the steps of: disposing a flip chip on a carrier substrate; filling an underfill material between at least two electrodes of the flip chip for supporting the flip-chip; laser lifting-off a growing substrate from the flip chip for forming a thin film chip and exposing an epitaxial structure from the thin film chip; roughening the epitaxial structure exposed from the thin film chip; providing a view angle adjusting structure including a wavelength converting layer on the thin film chip, and selecting a predetermined view angle and achieving the predetermined view angle by adjusting the view angle adjusting structure according to a linear regression formula.
    Type: Application
    Filed: September 25, 2017
    Publication date: July 26, 2018
    Inventors: I-CHEN CHIEN, SHIH-CHANG HSU
  • Publication number: 20180212099
    Abstract: A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.
    Type: Application
    Filed: March 22, 2018
    Publication date: July 26, 2018
    Inventors: I-Chen Chien, Shih-Chang Hsu
  • Patent number: 10032962
    Abstract: An LED package structure includes a conductive frame assembly, a reflective housing, an UV LED chip disposed on the conductive frame assembly, and a die-attach adhesive for bonding the UV LED chip to the conductive frame assembly. The reflective housing includes Silicone Molding Compound (SMC) and filler mixed in the SMC. The energy gap of the filler is greater than or equal to 4 eV. The energy gap of the filler thereof can be chosen by the following formulas. When the refractive index difference between the filler and the SMC is less than or equal to 0.2, the energy gap of the filler is satisfied the following formula. E?1240 (nm·eV)/(??150(nm)). When the refractive index difference between the filler and the SMC is greater than 0.2, the energy gap of the filler is satisfied the following formula. E?1240(nm·eV)/(??50(nm)).
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: July 24, 2018
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: I-Chen Chien, Shih-Chang Hsu
  • Patent number: 9966499
    Abstract: A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: May 8, 2018
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: I-Chen Chien, Shih-Chang Hsu
  • Publication number: 20170352778
    Abstract: A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.
    Type: Application
    Filed: November 21, 2016
    Publication date: December 7, 2017
    Inventors: I-CHEN CHIEN, SHIH-CHANG HSU
  • Publication number: 20170200867
    Abstract: An LED package structure includes a conductive frame assembly, a reflective housing, an UV LED chip disposed on the conductive frame assembly, and a die-attach adhesive for bonding the UV LED chip to the conductive frame assembly. The reflective housing includes Silicone Molding Compound (SMC) and filler mixed in the SMC. The energy gap of the filler is greater than or equal to 4 eV. The energy gap of the filler thereof can be chosen by the following formulas. When the refractive index difference between the filler and the SMC is less than or equal to 0.2, the energy gap of the filler is satisfied the following formula. E?1240 (nm·eV)/(??150(nm)). When the refractive index difference between the filler and the SMC is greater than 0.2, the energy gap of the filler is satisfied the following formula. E?1240(nm·eV)/(??50(nm)).
    Type: Application
    Filed: May 23, 2016
    Publication date: July 13, 2017
    Inventors: I-Chen Chien, Shih-Chang Hsu
  • Publication number: 20150010769
    Abstract: A method for preparing core-shell and hollow silver particles is provided. In the method silver salts and glycine nitrate or starch are mixed with solvent to form precursor solution. The mole percentage of the silver salts over the silver salts plus glycine nitrate or starch is 5 to 50 mol %. The precursor solution is then atomized to form precursor droplets. The precursor droplets are heated by pyrolysis to form silver particles. The composition of the precursor solution can be adjusted to finely manipulate the structure of the silver particles.
    Type: Application
    Filed: November 22, 2013
    Publication date: January 8, 2015
    Applicant: National Taiwan University of Science and Technology
    Inventors: Shao-Ju Shih, I-Chen Chien, Yu-Hsuan Wu