Abstract: A method for manufacturing a dull polyamide 56 fiber includes steps as follows. Bright polyamide 56 chips are provided. A viscosity adjusting step is provided, wherein a relative viscosity in sulfuric acid of the bright polyamide 56 chips is adjusted to a range of 2.90 to 3.00. A moisture adjusting step is provided, wherein a moisture content of the bright polyamide 56 chips is adjusted to a range of 350 to 550 ppm. A spinning step is provided, which includes providing dull polyamide 6 chips and a blending step. The dull polyamide 6 chips include TiO2. In the blending step, the dull polyamide 6 chips and the bright polyamide 56 chips dealt with the viscosity adjusting step and the moisture adjusting step are melted and blended, and then spun at a temperature ranging from 275° C. to 285° C., thus the dull polyamide 56 fiber is obtained.

Abstract: A method for manufacturing a dull polyamide 56 fiber includes steps as follows. Bright polyamide 56 chips are provided. A viscosity adjusting step is provided, wherein a relative viscosity in sulfuric acid of the bright polyamide 56 chips is adjusted to a range of 2.90 to 3.00. A moisture adjusting step is provided, wherein a moisture content of the bright polyamide 56 chips is adjusted to a range of 350 to 550 ppm. A spinning step is provided, which includes providing dull polyamide 6 chips and a blending step. The dull polyamide 6 chips include TiO2. In the blending step, the dull polyamide 6 chips and the bright polyamide 56 chips dealt with the viscosity adjusting step and the moisture adjusting step are melted and blended, and then spun at a temperature ranging from 275° C. to 285° C., thus the dull polyamide 56 fiber is obtained.

Abstract: A nail polish curing device comprises: a lower part having a top surface and a reflective lower recess-defining surface that extends downwardly from the top surface and that defines a lower recess; an upper part disposed above the lower part and having a top wall, a bottom surface, and a reflective upper recess-defining surface that extends upwardly from the bottom surface and that defines an upper recess, the top wall being formed with a plurality of through-holes; a circuit board mounted on the top wall of the upper part; and a plurality of light emitting elements mounted on and electrically connected to the circuit board and extending respectively through the through-holes into the upper recess so as to emit light into the upper and lower recesses.

Abstract: A nail polish curing device comprises: a lower part defining a lower recess; an upper part pivoted to the lower part and defining an upper recess; a circuit board mounted on the upper part; and at least one light emitting element connected to the circuit board. The upper part is rotatable relative to the lower part between a first angular position, in which the upper and lower recesses overlap along a vertical direction and cooperate with each other to define an accommodating space for receiving a user's finger therein, and a second angular position, in which the upper and lower recesses do not overlap along the vertical direction, thereby facilitating insertion of a user's toe into an irradiating space between a bottom surface of the upper part and a reference surface.

Abstract: A nail polish curing device comprises: a lower part defining a lower recess; an upper part pivoted to the lower part and defining an upper recess; a circuit board mounted on the upper part; and at least one light emitting element connected to the circuit board. The upper part is rotatable relative to the lower part between a first angular position, in which the upper and lower recesses overlap along a vertical direction and cooperate with each other to define an accommodating space for receiving a user's finger therein, and a second angular position, in which the upper and lower recesses do not overlap along the vertical direction, thereby facilitating insertion of a user's toe into an irradiating space between a bottom surface of the upper part and a reference surface.

Abstract: A nail polish curing device comprises: a lower part having a top surface and a reflective lower recess-defining surface that extends downwardly from the top surface and that defines a lower recess; an upper part disposed above the lower part and having a top wall, a bottom surface, and a reflective upper recess-defining surface that extends upwardly from the bottom surface and that defines an upper recess, the top wall being formed with a plurality of through-holes; a circuit board mounted on the top wall of the upper part; and a plurality of light emitting elements mounted on and electrically connected to the circuit board and extending respectively through the through-holes into the upper recess so as to emit light into the upper and lower recesses.