Patents by Inventor I-Cheng Chuang

I-Cheng Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150200063
    Abstract: A switch structure and an electronic device using the same are provided. The electronic device has a casing, and the switch structure is disposed at an inner side of the key portion of the casing. The switch structure includes an elastic member, a force transmission member and a strain sensor. The elastic member is connected to the casing. The force transmission member is located inside the casing. The strain sensor is disposed on the elastic member, and the strain sensor and the force transmission member are disposed are two opposite sides of the elastic member respectively. The elastic member is configured to be deformed by the force transmission member when an external force is applied to an outside of the key portion.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 16, 2015
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu, Hung-Wen Lin
  • Publication number: 20150173237
    Abstract: An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.
    Type: Application
    Filed: December 17, 2013
    Publication date: June 18, 2015
    Applicant: HTC Corporation
    Inventors: Hung-Wen Lin, Ting-An Kuo, Yu-Jing Liao, I-Cheng Chuang
  • Patent number: 9055206
    Abstract: An electronic device including a housing, a support member, and a camera module is provided. The housing has a bump. The bump extends toward the outside of the electronic device and correspondingly forms a recess on the inside of the housing. The support member includes a chassis and a holder. The chassis is disposed inside the housing. The holder includes a body, an accommodation recess located on the body and facing the recess, and a skirt extending outwardly from a side of the accommodation recess. The holder is supported against the chassis through the skirt. The camera module is disposed inside the accommodation recess, and a portion of the camera module protrudes outside the accommodation recess, wherein the protruding portion is located in the recess, and the support member is located outside the recess, such that a sidewall of the recess faces and surrounds the camera module.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: June 9, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Hung-Wen Lin
  • Publication number: 20150138434
    Abstract: An electronic device including a housing, a support member, and a camera module is provided. The housing has a bump. The bump extends toward the outside of the electronic device and correspondingly forms a recess on the inside of the housing. The support member includes a chassis and a holder. The chassis is disposed inside the housing. The holder includes a body, an accommodation recess located on the body and facing the recess, and a skirt extending outwardly from a side of the accommodation recess. The holder is supported against the chassis through the skirt. The camera module is disposed inside the accommodation recess, and a portion of the camera module protrudes outside the accommodation recess, wherein the protruding portion is located in the recess, and the support member is located outside the recess, such that a sidewall of the recess faces and surrounds the camera module.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 21, 2015
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Hung-Wen Lin
  • Publication number: 20150130974
    Abstract: A camera assembly, including at least one holder, at least one camera module, and a buffer material, is provided. The holder includes at least one accommodating recess. The camera module is disposed in the accommodating recess, and a gap exists between the camera module and a sidewall of the accommodating recess. The buffer material is filled in the gap to position the camera module in the accommodating recess of the holder. Further, an electronic device including a housing and the camera assembly aforementioned is provided.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 14, 2015
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Hung-Wen Lin
  • Publication number: 20150116957
    Abstract: An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board.
    Type: Application
    Filed: October 28, 2013
    Publication date: April 30, 2015
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Cheng-Te Chen
  • Patent number: 9007776
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 14, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 8986051
    Abstract: A socket connector having high current carrying capacity is provided by enlarging cross-section of particular terminals, to meet requirement such as transmitting large current or quick charge. Furthermore, a plug connector coupled with the socket connector, a connector assembly including the socket connector and the plug connector, and a handheld electronic device applying the socket connector are provided.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: March 24, 2015
    Assignee: HTC Corporation
    Inventors: Chih-Wei Tu, Ta-Wei Liu, I-Cheng Chuang
  • Publication number: 20150064966
    Abstract: A connector assembly adapted to be disposed in a casing of an electronic device is provided. The connector assembly includes a connector and a locking member. The locking member includes a supporting portion and a holding portion connected to the supporting portion. The connector is disposed on the supporting portion. The locking member is adapted to clamp at an end of a substrate disposed in the casing, and the supporting portion and the holding portion lean against an upper side and a lower side of the end of the substrate respectively. An electronic device including the connector assembly aforementioned is also provided.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 5, 2015
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Publication number: 20150015546
    Abstract: A stylus includes a rod and a conductive material. The rod has a first end that is tapered to form a tip, and the conductive material covers all surfaces of the rod. A method for manufacturing a stylus includes following steps. A rod is provided. The rod is placed between a first mold core and a second mold core. The first and second mold cores are combined, so that the rod is located in a mold cavity constructed by the first and second mold cores. A conductive material is formed in the mold cavity. The conductive material is cured on a surface of the rod to form a stylus. The first and second mold cores are separated from each other. The resultant stylus located between the first and second mold cores is taken out.
    Type: Application
    Filed: July 9, 2013
    Publication date: January 15, 2015
    Inventors: Shih-Po Chien, Pi-Lin Lo, Yu-Jing Liao, I-Cheng Chuang
  • Publication number: 20140306585
    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.
    Type: Application
    Filed: April 16, 2013
    Publication date: October 16, 2014
    Inventors: Chih-Kai Hu, Yu-Jing Liao, I-Cheng Chuang
  • Publication number: 20140293555
    Abstract: A receptacle connector adapted to be fixed to a casing of an electronic device and electrically connected to a circuit board for enabling the receptacle connector to be adapted to connect with a plug connector is provided. The receptacle connector includes an insulating body and a plurality of conductive terminals. The insulating body has a tunnel, and the tunnel extends from the outer side of the insulating body to the inner side of the insulating body, wherein a side of the tunnel is exposed at a top portion of the insulating body, and the insulating body is adapted to be fixed to the casing to cover the side of the tunnel, so that the tunnel is adapted to form a plug hole with the casing. The conductive terminals are disposed through the insulating body. A receptacle connector and an electronic device are also provided.
    Type: Application
    Filed: April 2, 2013
    Publication date: October 2, 2014
    Inventors: Ying-Yen Cheng, Wan-Hsieh Liu, I-Cheng Chuang, Hsin-Chih Liu, Chih-Wei Tu, Cheng-Lung Chang, Chien-Ping Chen
  • Publication number: 20140268585
    Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.
    Type: Application
    Filed: November 1, 2013
    Publication date: September 18, 2014
    Applicant: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Publication number: 20140218629
    Abstract: A touch panel assembly includes a touch panel and a flexible circuit board. The touch panel includes a sensing array having sensing units, first connection lines, second connection lines, at least one input element, and pads. The first and second connection lines are outside the sensing array and electrically connected to the sensing units respectively. The input element is outside the sensing array and close to a side of the touch panel. The pads are in a bonding region of the touch panel and electrically connected to the first and second connection lines respectively. The bonding region is close to the side of the touch panel and is arranged along with the input element in parallel to the side of the touch panel. The flexible circuit board has a connecting portion extended and attached to the bonding region. Terminals of the connecting portion are electrically connected to the pads respectively.
    Type: Application
    Filed: February 7, 2013
    Publication date: August 7, 2014
    Applicant: HTC CORPORATION
    Inventors: I-Cheng Chuang, Shih-Po Chien, Yi-Ting Liu, Chia-Hsiung Peng, Chi-Jer Wang
  • Patent number: 8791915
    Abstract: A portable electronic device is provided suitable for operation by a single user. The portable electronic device comprises a main body and at least a thin film pattern. The main body has a display region and a non-display region coupled to the display region. The thin film pattern is disposed on a local region of the display region, on a local region of the non-display region, or on both a local region of the display region and a local region of the non-display region. The thin film pattern is visible while a user does not operate the portable electronic device. The thin film pattern is invisible while a user operates the portable electronic device.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: July 29, 2014
    Assignee: HTC Corporation
    Inventors: Yao-Wen Yeh, I-Cheng Chuang
  • Publication number: 20140168924
    Abstract: A button assembly suitable for being disposed at an opening of a housing of a handheld electronic device is provided. The button assembling includes a button, a signal-receiving-and-transmitting component and a switch. The button is movably disposed at the opening, and the button has a pressing portion exposed by the housing. The signal-receiving-and-transmitting component is disposed in the housing and corresponds to the pressing portion, wherein the signal-receiving-and-transmitting component is suitable for transmitting or receiving a wireless signal passing through the pressing portion. The switch is disposed in the housing and coupled to the button, so that the switch is adapted to be actuated by pressing the pressing portion of the button. A handheld electronic device including a body, a housing and a button assembly is also provided. The housing covers the body and has an opening. The button assembly is disposed at the opening.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: HTC CORPORATION
    Inventors: Kuan-Ku Kuo, I-Cheng Chuang, Yu-Jing Liao
  • Publication number: 20140168908
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: HTC CORPORATION
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 8753151
    Abstract: A connector module includes an electrical connector and a sound-receiving component. The connector includes an insulation casing and multiple conductive terminals disposed at and passing through the insulating casing. The insulation casing has a jack hole at the outer-side thereof and a channel at the inner-side thereof and extending along an axial direction. The connector is adapted to connect the plug plugged into the channel from the jack hole. The sound-receiving component is disposed at the insulation casing along a radial direction, wherein the insulation casing has an opening communicated with the channel and corresponding to the sound-receiving component and the sound-receiving component is adapted to receive the sound transmitted into the channel from the jack hole via the opening. A handheld electronic device is also provided which includes a casing and a connector module disposed in the casing and adapted to connect a plug or receive a sound.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: June 17, 2014
    Assignee: HTC Corporation
    Inventors: Ying-Yen Cheng, I-Cheng Chuang, Chih-Wei Tu, Yin-Chou Chen
  • Patent number: D732040
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: June 16, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Shih-Po Chien, Yi-Ting Liu, Chia-Hsiung Peng, Chi-Jer Wang
  • Patent number: D735175
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: July 28, 2015
    Assignee: HTC Corporation
    Inventors: Yi-Ting Liu, I-Cheng Chuang