Patents by Inventor I-Cheng Keng

I-Cheng Keng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip scale packaging with improved heat dissipation capability
    Patent number: 7030487
    Abstract: A chip scale packaging with improved heat dissipation capability is disclosed. A chip or die is adhered to the first surface of a packaging substrate having a plurality of metalized through holes thereon. A functional solder ball array is implanted on the second surface of the packaging substrate. Heat-dissipating solder balls are implanted around the functional solder ball array on the second surface of the packaging substrate. The heat-dissipating solder balls are connected to the metalized through holes. The bonding pads of the chip are bonded through a central window to the corresponding bonding pads on the second surface of the packaging substrate.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: April 18, 2006
    Assignee: Nanya Technology Corp.
    Inventor: I-Cheng Keng