Patents by Inventor I-Cheng YEH

I-Cheng YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Input/output module baffle and motherboard with the same
    Patent number: 10114427
    Abstract: An input/output module baffle is adapted to an electronic device. The electronic device includes a motherboard and a casing. The motherboard is located inside the casing and includes a connector module. The input/output module baffle includes a fixing plate, a conductive component and a frame. The fixing plate includes a plurality of retaining clips to clamp the fixing plate on the connector module. The conductive component is located between the fixing plate and the connector module. The frame is located between the fixing plate and the casing. Moreover, a motherboard with the input/output module baffle is also disclosed herein.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: October 30, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Yao-Hsun Huang, Yu-Chen Lee, Shu-Fen Huang, I-Cheng Yeh, Jonathan Chu, Ming-Hung Chung
  • INPUT/OUTPUT MODULE BAFFLE AND MOTHERBOARD WITH THE SAME
    Publication number: 20170332504
    Abstract: An input/output module baffle is adapted to an electronic device. The electronic device includes a motherboard and a casing. The motherboard is located inside the casing and includes a connector module. The input/output module baffle includes a fixing plate, a conductive component and a frame. The fixing plate includes a plurality of retaining clips to clamp the fixing plate on the connector module. The conductive component is located between the fixing plate and the connector module. The frame is located between the fixing plate and the casing. Moreover, a motherboard with the input/output module baffle is also disclosed herein.
    Type: Application
    Filed: April 6, 2017
    Publication date: November 16, 2017
    Inventors: Yao-Hsun HUANG, Yu-Chen LEE, Shu-Fen HUANG, I-Cheng YEH, Jonathan CHU, Ming-Hung CHUNG