Patents by Inventor I Chiu
I Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240024868Abstract: Provided is a microfluidic detection device, including a base with a microfluidic channel structure formed on the base and a lid covering the base. The microfluidic channel structure includes a sample well for loading a sample, a detection well having a first reagent for reacting with the sample, and a channel connecting the sample well and the detection well. The detection well has a recess deeper than the channel, and the base includes a protrusion corresponding to the recess to form a space between the protrusion and the recess. Also provided is a method for rapid diagnostic testing by the microfluidic detection device.Type: ApplicationFiled: July 25, 2023Publication date: January 25, 2024Inventors: Ching-Yun Chen, Cherng-Jyh Ke, Shih-Tien Hsu, Ching-Wen Tsai, Si-Ting Wu, Yi-Hsuan Tung, Hsin-I Chiu, Sheng-Wen Chang, Jing-Ke Chen, Yueh-Teng Tsai, Ching Yu, Jian-Hua Chang
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Patent number: 11699011Abstract: An method, a computer readable medium and a system for an automated design of a controllable oscillator are provided, wherein the method includes: receiving a set of input data through an automated design procedure, wherein the set of input data includes an initial circuit description file and a criteria file, and the initial circuit description file records initial values of parameters of one or more components within the controllable oscillator; performing simulation according to the set of input data through the automated design procedure to generate a simulation result; and selectively modifying at least one parameter within the parameters of the one or more components according to the simulation result through the automated design procedure. In addition, in the process of modifying the at least one parameter, connection relationships of all components within the controllable oscillator are unchanged.Type: GrantFiled: July 23, 2020Date of Patent: July 11, 2023Assignee: SigmaStar Technology Ltd.Inventors: Hsian-Feng Liu, Ming-Jei Liu, Chun-I Chiu, Wei-Chih Cheng
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Patent number: 11020594Abstract: The invention relates to an electrochemical dephosphorylation technique for treating Alzheimer's disease and a use thereof. It comprises a gold electrode provided with a negative potential of ?0.2 V to ?0.6 V on a surface thereof.Type: GrantFiled: June 14, 2019Date of Patent: June 1, 2021Assignee: National Chiao Tung UniversityInventors: Jung-Chih Chen, I-Chiu Li, Kun-Che Li, Ching-Cheng Chuang, Mei-Lan Ko, Hsin-Yu Chen, Chia-Hsuan Chang, Hsin-Yi Tsai, Chien-Chih Hsu
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Publication number: 20210034803Abstract: An method, a computer readable medium and a system for an automated design of a controllable oscillator are provided, wherein the method includes: receiving a set of input data through an automated design procedure, wherein the set of input data includes an initial circuit description file and a criteria file, and the initial circuit description file records initial values of parameters of one or more components within the controllable oscillator; performing simulation according to the set of input data through the automated design procedure to generate a simulation result; and selectively modifying at least one parameter within the parameters of the one or more components according to the simulation result through the automated design procedure. In addition, in the process of modifying the at least one parameter, connection relationships of all components within the controllable oscillator are unchanged.Type: ApplicationFiled: July 23, 2020Publication date: February 4, 2021Inventors: Hsian-Feng Liu, Ming-Jei Liu, Chun-I Chiu, Wei-Chih Cheng
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Publication number: 20200391033Abstract: The invention relates to an electrochemical dephosphorylation technique for treating Alzheimer's disease and a use thereof. It comprises a gold electrode provided with a negative potential of ?0.2 V to ?0.6 V on a surface thereof.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Inventors: JUNG-CHIH CHEN, I-CHIU LI, KUN-CHE LI, CHING-CHENG CHUANG, MEI-LAN KO, HSIN-YU CHEN, CHIA-HSUAN CHANG, HSIN-YI TSAI, CHIEN-CHIH HSU
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Patent number: 10677805Abstract: The invention relates to color-changing eye drops for early screening Alzheimer's disease and an application thereof. The color-changing eye drop for early screening Alzheimer's disease comprises 1 pg/ml to 10 ng/ml of A?42 aptamer-gold nanoparticles (AuNPs) and a pharmaceutically acceptable carrier or vehicle thereof, which can be used to mix with a tear sample of a test subject to analyze a color change of the color-changing eye drop for determining the concentration proportion of A?40:A?42 contained in the tear sample of the test subject.Type: GrantFiled: June 14, 2019Date of Patent: June 9, 2020Assignee: NATIONAL CHIAO TUNG UNIVERSITYInventors: Jung-Chih Chen, I-Chiu Li, Kun-Che Li, Ching-Cheng Chuang, Mei-Lan Ko, Han-Chien Chuang, Ming-Hung Chien, Yu-Rong Wang, Hung-Ru Wang
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Patent number: 10597444Abstract: Monoclonal antibodies that bind and inhibit the activity of human GDF15 are disclosed. The antibodies can be used to treat body weight loss, including cachexia, associated with the over-expression of human GDF15.Type: GrantFiled: July 20, 2017Date of Patent: March 24, 2020Assignee: AVEO Pharmaceuticals, Inc.Inventors: Lorena Lerner, Sandra Abbott, Ailin Bai, Ting Chen, Maria I. Chiu, Qing Liu, Laura Poling, Nianjun Tao, Solly Weiler, Zhigang Weng, William M. Winston, Jr., Jeno Gyuris
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Patent number: 10083950Abstract: A die stacking method is provided. The die stacking method includes executing a manufacturing recipe, and loading an interposer-die mapping file according to the manufacturing recipe. The interposer-die mapping file corresponds to an interposer wafer including interposer dies. The die stacking method also includes loading a combination setting data according to the interposer-die mapping file, and loading a top die number and a top-die ID code of a top-die mapping file according to the combination setting data and the interposer-die mapping file. The top-die ID code corresponds to a top wafer including top dies, and the top die number corresponds to one of the top dies. The die stacking method also includes disposing the one of the top dies of the top wafer on one of the interposer dies of the interposer wafer.Type: GrantFiled: December 15, 2016Date of Patent: September 25, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Larry Jann, Chih-Chien Chang, Po-Wen Chuang, Ming-I Chiu, Chang-Hsi Lin, Chih-Chan Li, Yi-Ting Hu
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Publication number: 20180142013Abstract: Monoclonal antibodies that bind and inhibit the activity of human GDF15 are disclosed. The antibodies can be used to treat body weight loss, including cachexia, associated with the over-expression of human GDF15.Type: ApplicationFiled: July 20, 2017Publication date: May 24, 2018Inventors: Lorena Lerner, Sandra Abbott, Ailin Bai, Ting Chen, Maria I. Chiu, Qing Liu, Laura Poling, Nianjun Tao, Solly Weiler, Zhigang Weng, William M. Winston, Jr., Jeno Gyuris
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Patent number: 9896730Abstract: The present invention provides diagnostic methods for assessing the EMT status of tumor cells, and for predicting the effectiveness of treatment of a cancer patient with an EGFR or IGF-1R kinase inhibitor, utilizing an EMT gene signature index score. The present invention further provides methods for treating patients with cancer that incorporate these methods.Type: GrantFiled: April 25, 2012Date of Patent: February 20, 2018Assignees: OSI Pharmaceuticals, LLC, AVEO PHARMACEUTICALS, INC.Inventors: Julie Kan, Stuart Thomson, Gretchen M. Argast, Matthew E. O'Connor, Murray Robinson, Bin Feng, Joerg Heyer, Maria I. Chiu, Richard Nicoletti
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Patent number: 9725505Abstract: Monoclonal antibodies that bind and inhibit the activity of human GDF15 are disclosed. The antibodies can be used to treat body weight loss, including cachexia, associated with the over-expression of human GDF15.Type: GrantFiled: September 24, 2015Date of Patent: August 8, 2017Assignee: AVEO Pharmaceuticals, Inc.Inventors: Lorena Lerner, Sandra Abbott, Ailin Bai, Ting Chen, Maria I. Chiu, Qing Liu, Laura Poling, Nianjun Tao, Solly Weiler, Zhigang Weng, William M. Winston, Jr., Jeno Gyuris
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Publication number: 20170098639Abstract: A die stacking method is provided. The die stacking method includes executing a manufacturing recipe, and loading an interposer-die mapping file according to the manufacturing recipe. The interposer-die mapping file corresponds to an interposer wafer including interposer dies. The die stacking method also includes loading a combination setting data according to the interposer-die mapping file, and loading a top die number and a top-die ID code of a top-die mapping file according to the combination setting data and the interposer-die mapping file. The top-die ID code corresponds to a top wafer including top dies, and the top die number corresponds to one of the top dies. The die stacking method also includes disposing the one of the top dies of the top wafer on one of the interposer dies of the interposer wafer.Type: ApplicationFiled: December 15, 2016Publication date: April 6, 2017Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Larry JANN, Chih-Chien CHANG, Po-Wen CHUANG, Ming-I CHIU, Chang-Hsi LIN, Chih-Chan LI, Yi-Ting HU
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Patent number: 9536814Abstract: Embodiments of a die stacking apparatus are provided. The die stacking apparatus includes a storage device configured to contain a top wafer and an interposer wafer. The top wafer has a number of top dies, and the interposer wafer has a number of interposer dies. The die stacking apparatus also includes a carrier device configured to carry the interposer wafer, and a transferring device configured to transfer the interposer wafer to the carrier device and to dispose the top dies on the interposer dies. The die stacking apparatus further includes a process module configured to control the transferring device. The process module controls the transferring device to transfer the interposer wafer to the carrier device, and controls the transferring device to dispose the top dies on the interposer dies of the interposer wafer, which is stacked on the carrier device.Type: GrantFiled: February 24, 2014Date of Patent: January 3, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Larry Jann, Chih-Chien Chang, Po-Wen Chuang, Ming-I Chiu, Chang-Hsi Lin, Chih-Chan Li, Yi-Ting Hu
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Publication number: 20160140440Abstract: Disclosed herein are techniques for implementing a machine intelligence computer system that can proactively monitor user audiovisual feedbacks as ques for improving the machine learning and predictive data analytical processes. Based on the real-time feedbacks, the introduced proactive machine intelligence system (PMIS) can dynamically revise (e.g., by assigning different weights) and/or filter the gathered input data for machine learning purposes. The PMIS can also dynamically adjust the machine learning algorithms adapted in the predictive models based on user real-time feedbacks.Type: ApplicationFiled: November 16, 2015Publication date: May 19, 2016Inventors: Jay-Jen Hsueh, Wen-Hao Tsai, Yi-I Chiu, Kuan-Jun Tien, Zixiang Xuan
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Publication number: 20160083465Abstract: Monoclonal antibodies that bind and inhibit the activity of human GDF15 are disclosed. The antibodies can be used to treat body weight loss, including cachexia, associated with the over-expression of human GDF15.Type: ApplicationFiled: September 24, 2015Publication date: March 24, 2016Inventors: Lorena Lerner, Sandra Abbott, Ailin Bai, Ting Chen, Maria I. Chiu, Qing Liu, Laura Poling, Nianjun Tao, Solly Weiler, Zhigang Weng, William M. Winston, JR., Jeno Gyuris
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Patent number: 9180609Abstract: This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure.Type: GrantFiled: August 26, 2014Date of Patent: November 10, 2015Assignee: UBright Optronics CorporationInventors: Ching-An Yang, Wei-Tai C.-I. Chiu, Han-Tsung Pan, Lung-Pin Hsin, Yu-Mei Juan
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Publication number: 20150243630Abstract: Embodiments of a die stacking apparatus are provided. The die stacking apparatus includes a storage device configured to contain a top wafer and an interposer wafer. The top wafer has a number of top dies, and the interposer wafer has a number of interposer dies. The die stacking apparatus also includes a carrier device configured to carry the interposer wafer, and a transferring device configured to transfer the interposer wafer to the carrier device and to dispose the top dies on the interposer dies. The die stacking apparatus further includes a process module configured to control the transferring device. The process module controls the transferring device to transfer the interposer wafer to the carrier device, and controls the transferring device to dispose the top dies on the interposer dies of the interposer wafer, which is stacked on the carrier device.Type: ApplicationFiled: February 24, 2014Publication date: August 27, 2015Applicant: Taiwan Semiconductor Manufacturing Co., LtdInventors: Larry JANN, Chih-Chien CHANG, Po-Wen CHUANG, Ming-I CHIU, Chang-Hsi LIN, Chih-Chan LI, Yi-Ting HU
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Publication number: 20140367873Abstract: This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure.Type: ApplicationFiled: August 26, 2014Publication date: December 18, 2014Inventors: Ching-An YANG, Wei-Tai C.-I. CHIU, Han-Tsung PAN, Lung-Pin HSIN, Yu-Mei JUAN
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Publication number: 20120302572Abstract: The present invention provides diagnostic methods for assessing the EMT status of tumor cells, and for predicting the effectiveness of treatment of a cancer patient with an EGFR or IGF-1R kinase inhibitor, utilizing an EMT gene signature index score. The present invention further provides methods for treating patients with cancer that incorporate these methods.Type: ApplicationFiled: April 25, 2012Publication date: November 29, 2012Applicants: AVEO PHARMACEUTICALS, INC., OSI Pharmaceuticals, LLCInventors: Julie Kan, Stuart Thomson, Gretchen M. Argast, Matthew E. O'Connor, Murray Robinson, Bin Feng, Joerg Heyer, Maria I. Chiu, Richard Nicoletti
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Publication number: 20100171734Abstract: A system and method for extending operating time of an electronic device is disclosed. A battery power module provides power to a display module. A battery capacity detection module detects battery capacity of the battery power module. The pixels of the display module are then individually activated or deactivated according to the detected battery capacity.Type: ApplicationFiled: January 8, 2009Publication date: July 8, 2010Inventor: Tsung-I Chiu