Patents by Inventor I-Chuan Lai

I-Chuan Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220341677
    Abstract: A cooling module includes a thermally conductive plate and a heat pipe. The thermally conductive plate includes a groove having two inner walls that are opposite to each other, a first upper protrusion protrusively located on the plate body and the first inner wall, a second upper protrusion protrusively located on the plate body and the second inner wall, a first lower protrusion protrusively located on the first inner wall, and a second lower protrusion protrusively located on the second inner wall. The heat pipe is located in the groove, and cooperatively secured by the first upper protrusion, the second upper protrusion, the first lower protrusion and the second lower protrusion.
    Type: Application
    Filed: March 15, 2022
    Publication date: October 27, 2022
    Inventors: Chun Lin TU, I Chuan LAI, Wei Po CHEN, Chung Lin CHEN
  • Publication number: 20040159350
    Abstract: An inflation valve includes a valve body having a head portion and an extended portion extending integrally from the head portion, and a needle holder disposed within the valve body. The extended portion has a central passage with a length that is sufficient to prevent an inflation needle from extending therethrough. The needle holder includes a central inflation hole that is in fluid communication with the central passage and that is adapted to permit extension of the inflation needle therethrough.
    Type: Application
    Filed: February 13, 2003
    Publication date: August 19, 2004
    Inventor: I-Chuan Lai
  • Patent number: 6726583
    Abstract: A game ball includes a carcass made up of a plurality of multi-layered carcass segments that are sewn together to form the carcass. Each carcass segment has a major portion and a marginal portion that surrounds the major portion and that is thinner than the major portion.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: April 27, 2004
    Assignee: Ye Gin Enterprise, Co., Ltd.
    Inventor: I-Chuan Lai