Patents by Inventor I-Chun Lin
I-Chun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240121722Abstract: An example device is to monitor communications throughput rates and select modulation and coding protocols in order to minimize specific absorption rates experienced by users of the devices by minimizing or reducing transmission power settings.Type: ApplicationFiled: March 12, 2021Publication date: April 11, 2024Applicant: Hewlett-Packard Development Company, L.P.Inventors: I-Chen Lin, Chung-Chun Chen, Cheng-Fang Lin, Hung-Wen Cheng, Isaac Lagnado, Leo Joseph Gerten
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Patent number: 11952079Abstract: A method for controlling a derailleur in low battery remaining capacity includes determining whether a remaining capacity of a first battery of the derailleur is smaller than or equal to a first derailleur battery threshold. When the remaining capacity of the first battery is determined to be smaller than or equal to the first derailleur battery threshold, at least one of gear positions of the derailleur is invalided and non-selectable by the derailleur.Type: GrantFiled: January 26, 2021Date of Patent: April 9, 2024Assignee: TEKTRO TECHNOLOGY CORPORATIONInventors: Hsun-Yu Chuang, Hung-Jui Lin, I-Chun Liao
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Patent number: 11948920Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.Type: GrantFiled: August 30, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou
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Patent number: 11923413Abstract: Semiconductor structures are provided. The semiconductor structure includes a substrate and nanostructures formed over the substrate. The semiconductor structure further includes a gate structure surrounding the nanostructures and a source/drain structure attached to the nanostructures. The semiconductor structure further includes a contact formed over the source/drain structure and extending into the source/drain structure.Type: GrantFiled: February 7, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ta-Chun Lin, Kuo-Hua Pan, Jhon-Jhy Liaw, Chao-Ching Cheng, Hung-Li Chiang, Shih-Syuan Huang, Tzu-Chiang Chen, I-Sheng Chen, Sai-Hooi Yeong
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Publication number: 20200027757Abstract: A die transfer method and a die transfer system thereof are disclosed. The die transfer method includes the following steps: providing a wafer to generate a plurality of dies; transferring a plurality of dies to a surface of a substrate to fix the plurality of dies on the surface of the substrate; aligning the substrate with a target substrate, wherein the target substrate has a landing site and the position of at least one die corresponds to the position of the landing site; in an air environment or a liquid environment, executing lyophilic or lyophobic treatment as compared to the periphery respectively to a bonding surface between the at least one die and the landing site of the target substrate; transferring the at least one die onto the landing site of the target substrate; and fixing the at least one die at the landing site.Type: ApplicationFiled: July 9, 2019Publication date: January 23, 2020Inventor: I-Chun Lin
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Publication number: 20200023479Abstract: A die transfer method and a die transfer system thereof are disclosed. The die transfer method includes the following steps: providing a wafer to generate a plurality of dies; transferring a plurality of dies to a surface of a donor substrate to fix the plurality of dies on the surface of the donor substrate by a photoreactive adhesive layer; aligning the donor substrate with a target substrate, wherein the target substrate has a landing site and the position of at least one die corresponds to the position of the landing site; irradiating the donor substrate with a radiation beam to cause the photoreactive adhesive layer to drop the at least one die, such that the at least one die is transferred onto the landing site of the target substrate; and fixing the at least one die at the landing site.Type: ApplicationFiled: July 9, 2019Publication date: January 23, 2020Inventor: I-Chun Lin
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Patent number: 8690550Abstract: A membrane micropump includes a vibration chamber, at least one flow guide, at least one fluid inlet, at least one fluid outlet, at least one inlet rectifier, at least one outlet rectifier, a vibration membrane and an actuator. The vibration chamber includes at least one chamber inlet and at least one chamber outlet. The flow guide can be connected to the chamber inlet, the vibration chamber, the chamber outlet or in the vibration chamber, or it can have more pairs to enhance the effects. The inlet rectifier connects the chamber inlet to the fluid inlet. The outlet rectifier connects the chamber outlet to the fluid outlet. The vibration membrane is disposed on the vibration chamber. The actuator is connected to the vibration membrane to reciprocate the vibration membrane, enabling fluid to flow into the vibration chamber via the fluid inlet and flow out thereof via the fluid outlet.Type: GrantFiled: May 25, 2010Date of Patent: April 8, 2014Assignee: National Taiwan UniversityInventors: An-Bang Wang, Ming-Che Hsieh, I-Chun Lin, Wen-Huei Tsai
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Patent number: 8257794Abstract: A discontinuous capillary coating device is disclosed. A discontinuous capillary coating device. At least one capillary tube is filled with a coating material. At least one coating substrate receives a liquid coating film. At least one capillary tube holder holds the capillary tube, guiding movement of the capillary tube. At least one traversing mechanism drives the capillary tube holder or coating substrate to move.Type: GrantFiled: March 5, 2009Date of Patent: September 4, 2012Assignee: National Taiwan UniversityInventors: An-Bang Wang, I-Chun Lin, Fei-Yau Lu, Po-Ting Pan, Yi-Hung Wu
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Patent number: 8074460Abstract: A device for adjusting a temperature and a humidity using a wind power is provided. The device includes an inlet; an outlet connected to the inlet; a sprayer spraying a nebulized liquid into the device; and an airflow sensor electrically connected to the sprayer for activating the sprayer when an airflow passes through.Type: GrantFiled: July 10, 2008Date of Patent: December 13, 2011Assignee: National Taiwan UniversityInventors: An-Bang Wang, Chia-Fong Lee, Wen-Chin Tsai, I-Chun Lin, Fei-Yau Lu, Chih-Chieh Chen, Liang-Jenq Leu, Chuin-Shan Chen, Wen-Pin Shih
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Publication number: 20110158832Abstract: A membrane micropump includes a vibration chamber, at least one flow guide, at least one fluid inlet, at least one fluid outlet, at least one inlet rectifier, at least one outlet rectifier, a vibration membrane and an actuator. The vibration chamber includes at least one chamber inlet and at least one chamber outlet. The flow guide can be connected to the chamber inlet, the vibration chamber, the chamber outlet or in the vibration chamber, or it can have more pairs to enhance the effects. The inlet rectifier connects the chamber inlet to the fluid inlet. The outlet rectifier connects the chamber outlet to the fluid outlet. The vibration membrane is disposed on the vibration chamber. The actuator is connected to the vibration membrane to reciprocate the vibration membrane, enabling fluid to flow into the vibration chamber via the fluid inlet and flow out thereof via the fluid outlet.Type: ApplicationFiled: May 25, 2010Publication date: June 30, 2011Applicant: NATIONAL TAIWAN UNIVERSITYInventors: An-Bang Wang, Ming-Che Hsieh, I-Chun Lin, Wen-Huei Tsai
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Patent number: 7861944Abstract: A jet device is provided in the present invention. The jet device includes a chamber having a nozzle and a lateral channel, wherein the lateral channel is disposed along the outer side of a first side of the chamber, the nozzle is disposed at one end of the lateral channel and the chamber is connected with the lateral channel via the nozzle which is connected with the external space, wherein the fluid is filled in the chamber, the nozzle and the later channel and an arc and a block are disposed at the connection of the nozzle and the lateral channel; and a piston disposed at a second side of the chamber.Type: GrantFiled: December 31, 2007Date of Patent: January 4, 2011Assignee: National Taiwan UniversityInventors: Ruey-Hor Yen, Chi-Feng Lin, An-Bang Wang, Shu-Shen Hsu, I-Chun Lin
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Patent number: 7824736Abstract: A micro patch coating device includes a coating die with a micro channel structure. A coating fluid is supplied through a coating fluid inlet and an auxiliary fluid is supplied through an auxiliary fluid inlet. After a segment of a predetermined length of the coating fluid is formed at a two-phase fluid output section, the coating fluid flow is intercepted. In turn, a segment of predetermined length of the auxiliary fluid is formed at the two-phase fluid output section, and then the auxiliary fluid flow is intercepted. A two-phase fluid is formed and flows out of the coating die to the substrate to form micro patches thereon.Type: GrantFiled: May 30, 2007Date of Patent: November 2, 2010Assignee: National Taiwan UniversityInventors: An-Bang Wang, I-Chun Lin, Yi-Hua Wang, Chih-Kung Lee
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Publication number: 20100140091Abstract: An integrated electrophoresis device includes a passage, a receiving opening, a removal opening, and a set of electric field generators. The passage is provided with gel and buffer solution. The receiving opening is disposed in the passage. The removal opening is also disposed in the passage. The electric field generators generate an electric field in the passage so that a plurality of charged substances in the passage migrates from the receiving opening to the removal opening.Type: ApplicationFiled: February 12, 2009Publication date: June 10, 2010Applicant: NATIONAL TAIWAN UNIVERSITYInventors: An-Bang Wang, Chia-Wei Cheng, I-Chun Lin, Chun-Hui Yang, Po-Ting Pan, Chen-Chi Kuan, Yen-Chih Chen, Yi-Wei Lin, Fei-Yau Lu
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Publication number: 20100047452Abstract: A discontinuous capillary coating device. At least one capillary tube is filled with a coating material. At least one coating substrate receives a liquid coating film. At least one capillary tube holder holds the capillary tube, guiding movement of the capillary tube. At least one traversing mechanism drives the capillary tube holder or coating substrate to move.Type: ApplicationFiled: March 5, 2009Publication date: February 25, 2010Applicant: NATIONAL TAIWAN UNIVERSITYInventors: An-Bang Wang, I-Chun Lin, Fei-Yau Lu, Po-Ting Pan, Yi-Hung Wu
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Publication number: 20090108085Abstract: A device for adjusting a temperature and a humidity using a wind power is provided. The device includes an inlet; an outlet connected to the inlet; a sprayer spraying a nebulized liquid into the device; and an airflow sensor electrically connected to the sprayer for activating the sprayer when an airflow passes through.Type: ApplicationFiled: July 10, 2008Publication date: April 30, 2009Applicant: NATIONAL TAIWAN UNIVERSITYInventors: An-Bang WANG, Chia-Fong LEE, Wen-Chin TSAI, I-Chun LIN, Fei-Yau LU, Chih-Chieh CHEN, Liang-Jenq LEU, Chuin-Shan CHEN, Wen-Pin SHIH
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Patent number: 7487686Abstract: A high-precision vortex flow meter includes a blunt body having a predetermined dimension and being arranged inside a fluid channel to serve as a vortex shedder. The vortex flow meter also includes a temperature detecting device for detecting the vortex shedder temperature and a temperature control element for adjusting the vortex shedder temperature. A frequency measuring device is arranged in the downstream section of the blunt body for detecting the vortex shedding frequency. From the measured temperatures of the upstream fluid flow and that of the blunt body, an effective temperature and a temperature ratio are calculated. The kinematic viscosity of the fluid is looked up from database. By using the relationship between the Strouhal number and Reynolds number, the fluid flow rate is calculated. By employing different blunt body temperature, the measurement range of the flow meter can be broadly extended.Type: GrantFiled: April 27, 2007Date of Patent: February 10, 2009Assignee: National Taiwan UniversityInventors: An-Bang Wang, Ming-Hsun Wu, Yi-Hua Wang, I-Chun Lin, Chia-Chih Chen, Shiming Lin
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Publication number: 20090001194Abstract: A jet device is provided in the present invention. The jet device includes a chamber having a nozzle and a lateral channel, wherein the lateral channel is disposed along the outer side of a first side of the chamber, the nozzle is disposed at one end of the lateral channel and the chamber is connected with the lateral channel via the nozzle which is connected with the external space, wherein the fluid is filled in the chamber, the nozzle and the later channel and an arc and a block are disposed at the connection of the nozzle and the lateral channel; and a piston disposed at a second side of the chamber.Type: ApplicationFiled: December 31, 2007Publication date: January 1, 2009Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Ruey-Hor Yen, Chi-Feng Lin, An-Bang Wang, Shu-Shen Hsu, I-Chun Lin
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Publication number: 20080145537Abstract: A micro patch coating device includes a coating die with a micro channel structure. A coating fluid is supplied through a coating fluid inlet and an auxiliary fluid is supplied through an auxiliary fluid inlet. After a segment of a predetermined length of the coating fluid is formed at a two-phase fluid output section, the coating fluid flow is intercepted. In turn, a segment of predetermined length of the auxiliary fluid is formed at the two-phase fluid output section, and then the auxiliary fluid flow is intercepted. A two-phase fluid is formed and flows out of the coating die to the substrate to form micro patches thereon.Type: ApplicationFiled: May 30, 2007Publication date: June 19, 2008Inventors: An-Bang Wang, I-Chun Lin, Yi-Hua Wang, Chih-Kung Lee
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Publication number: 20080141785Abstract: A high-precision vortex flow meter includes a blunt body having a predetermined dimension and being arranged inside a fluid channel to serve as a vortex shedder. The vortex flow meter also includes a temperature detecting device for detecting the vortex shedder temperature and a temperature control element for adjusting the vortex shedder temperature. A frequency measuring device is arranged in the downstream section of the blunt body for detecting the vortex shedding frequency. From the measured temperatures of the upstream fluid flow and that of the blunt body, an effective temperature and a temperature ratio are calculated. The kinematic viscosity of the fluid is looked up from database. By using the relationship between the Strouhal number and Reynolds number, the fluid flow rate is calculated. By employing different blunt body temperature, the measurement range of the flow meter can be broadly extended.Type: ApplicationFiled: April 27, 2007Publication date: June 19, 2008Inventors: An-Bang Wang, Ming-Hsun Wu, Yi-Hua Wang, I-Chun Lin, Chia-Chih Chen, Shiming Lin