Abstract: A multi-layered ceramic electronic device is made by attaching respective inner bonding surfaces of two lead frames to two opposite electrode junctions of a multi-layered ceramic chip in such a manner that a predetermined buffer space is defined between respective bottom bonding portions of the lead frames and the bottom side of the multi-layered ceramic chip, and then applying a conductive polymer adhesive to bond the inner bonding surfaces of the lead frames to the electrode junctions of the multi-layered ceramic chip at a predetermined low bonding temperature and to electrically conduct the leaf frames to the electrode junctions of the multi-layered ceramic chip.