Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A precision protection jig with a base is provided and includes: a platform having its two ends provided with a first end portion and a second end portion, respectively, wherein a table connects bottoms of the first and second end portions, and a connection block is appropriately positioned on inner wall surfaces of the first and second end portions; a horizontal support jig having two ends provided with two connection plates, respectively, such that the connection plates allow the horizontal support jig to be transversely connected to the connection block of the first and second end portions, respectively; and a vertical support jig having two ends connected to the horizontal support jig and the table centrally and perpendicularly, respectively, wherein the horizontal support jig exerts lateral stress upon the first and second end portions, whereas the vertical support jig produces vertical stress.

Abstract: A golf ball pick-up device includes a body, which has a shape that allows the body to form a frame with a head of the golf club. The body has an end forming a clamping section that defines an internal receiving space. The clamping section also forms a sideway opening in communication with the receiving space. The clamping section uses the opening to lead a shaft of the golf club into the receiving space, so as to allow the clamping section to fit over and thus retain on the shaft of the golf club. A user may then use the frame formed by the body and the head of the golf club to pick up a golf ball, especially a ball that falls in a sand trap or a water hazard where hands may not reach to pick up the ball.

Abstract: A golf ball pick-up device includes a body, which has a shape that allows the body to form a frame with a head of the golf club. The body has an end forming a clamping section that defines an internal receiving space. The clamping section also forms a sideway opening in communication with the receiving space. The clamping section uses the opening to lead a shaft of the golf club into the receiving space, so as to allow the clamping section to fit over and thus retain on the shaft of the golf club. A user may then use the frame formed by the body and the head of the golf club to pick up a golf ball, especially a ball that falls in a sand trap or a water hazard where hands may not reach to pick up the ball.

Abstract: An electrochemical sensor with sample pretreatment function includes an insulating substrate, and an electrode system disposed on the substrate having at least a working electrode and a reference electrode. An electrically insulating layer partially covers the electrode system, so an exposed area of the electrode system not covered by the electrically insulting layer forms an electrochemical electrode reaction region that accommodates sample solution and an air vent. A reaction layer is disposed in the electrochemical electrode reaction region and includes at least an oxidoreductase, an electron mediator, and at least a carrier.