Patents by Inventor I-Chung Wu

I-Chung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microphone and head-mounted display
    Patent number: 11750967
    Abstract: A microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of supporting portions, a plurality of damping portions, and a bearing portion. The plurality of supporting portions are spaced apart from each other. Each of the plurality of damping portions is disposed on an inner surface of the corresponding supporting portion. The bearing portion is connected to the plurality of damping portions and is suspended between the plurality of supporting portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending sections.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: September 5, 2023
    Assignee: HTC Corporation
    Inventors: Li-Hsun Chang, Chen-Fu Chang, I-Chung Wu, Pei-Wen Wang
  • MICROPHONE AND HEAD-MOUNTED DISPLAY
    Publication number: 20230094428
    Abstract: A microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of supporting portions, a plurality of damping portions, and a bearing portion. The plurality of supporting portions are spaced apart from each other. Each of the plurality of damping portions is disposed on an inner surface of the corresponding supporting portion. The bearing portion is connected to the plurality of damping portions and is suspended between the plurality of supporting portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending sections.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 30, 2023
    Applicant: HTC Corporation
    Inventors: Li-Hsun Chang, Chen-Fu Chang, I-Chung Wu, Pei-Wen Wang