Abstract: The invention provides a conductive, resin-based composition, which includes a resinous material, and a conductive filler dispersed therein. The conductive filler includes a first conductive filler component and a second conductive filler component. The particles of the first conductive filler component are harder than those of the second conductive filler component, when measured using the Mohs hardness scale. The composition is subjected to shear mixing forces which shearingly disperse the first and second conductive filler components throughout the resinous material in such a way that the particles of the second conductive filler component occupy the interstitial voids within the network of first conductive filler component particles contained in the resinous material and thereby enhance conductivity.

Abstract: An anaerobically curing composition is comprised of (i) a silicone fluid formed as the reaction product of at least one first silane of formula I:R.sub.n Si(X).sub.4-n (I),wherein the R groups are the same or different and selected from the group consisting of hydrogen, C1-C12 alkyl, C6-C12 aryl, C7-C18 arylalkyl, C7-C18 alkylaryl, haloalkyl, haloaryl and monovalent ethylenically unsaturated radicals excluding (meth)acryloxy functional groups, X is a hydrolyzable functionality, and n is an integer of from 0 to 3, and at least one second silane of formula II:R.sup.1.sub.m R.sup.2.sub.p Si(X).sub.4-(m+p) (II),wherein R.sup.1 is a (meth)acrylic functional group and R.sup.