Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: An escaping device includes a main frame including a pair of vertical rods adapted to be fixedly mounted on an inner side of a wall, a pair of supporting rods horizontally mounted on the main frame and having a track, a supporting bracket mounted on the main frame, and a cable fixing rod fixedly arranged on the vertical rods, a suspending rail vertically mounted on the main frame and having a top provided with a pulley, a retractable ladder having two sides provided with two axles slidably fitted into the track of the supporting rods, the retractable ladder having a plurality of transverse rods each provided with a sleeve, a cable controlling means fastened on the supporting bracket, and a cable having an end secured to the cable fixing rod and another end extending through a bottom of the ladder, the pulley and the sleeves to connect with the cable controlling means.