Abstract: A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.

Abstract: An open loop power control method for setting a transmit power of mobile station (22) during a handoff from a voice over Internet protocol (VoIP) service to a circuit switched service sets a transmit power of the mobile station based upon a power level associated with the VoIP call. A disclosed example includes using an average power level of a reverse pilot channel of the VoIP call and correction factors based upon forward link and reverse link parameters during the VoIP call.