Abstract: A frame device includes a back board, a buckle member and a casing. The back board has a groove. The buckle member is disposed on the back board, and has a first part member and the second part member disposed corresponding to the groove, and a distance between the first part member and the second part member varies along a direction. The casing is provided with a hook having a first engaging part and a second engaging part, and a distance between the first engaging part and the second engaging part varies along the direction. The first part member is engaged with the first engaging part, and the second part member is engaged with the second engaging part.

Abstract: This disclosure relates to a combined power module that includes a base structure, a terminal structure, a second terminal, and a cover. The terminal structure includes a mount assembly and a plurality of first terminals. The mount assembly is assembled on the base structure. The first terminals are disposed on the mount assembly. The second terminal is disposed on the base structure. The cover is disposed on the base structure and covers at least part of the first terminals and at least part of the second terminal.

Abstract: A method of forming a semiconductor structure is provided. Two wafers are first bonded by oxide bonding. Next, the thickness of a first wafer is reduced using an ion implantation and separation approach, and a second wafer is thinned by using a removal process. First devices are formed on the first wafer, and a carrier is then attached over the first wafer, and an alignment process is performed from the bottom of the second wafer to align active regions of the second wafer for placement of the second devices with active regions of the first wafer for placement of the first devices. The second devices are then formed in the active regions of the second wafer. Furthermore, a via structure is formed through the first wafer, the second wafer and the insulation layer therebetween to connect the first and second devices on the two sides of the insulation layer.

Abstract: The present disclosure describes a method to form a semiconductor structure having an oxide structure on a wafer edge. The method includes forming a device layer on a first substrate, forming an interconnect layer on the device layer, forming an oxide structure on a top surface and along a sidewall surface of the interconnect layer, forming a bonding layer on the oxide structure and the interconnect layer, and bonding the device layer to a second substrate with the bonding layer.

Abstract: A method of manufacturing a semiconductor device structure includes bonding a device substrate to a first de-bond layer. The first de-bond layer is disposed on a first carrier substrate, and the device substrate has a first side facing the first carrier substrate and a second side opposite from the first side. The device substrate has a first width. A front-end-of-line (FEOL) process and a back-end-of-line (BEOL) process are performed on the device substrate. A second carrier substrate having a second de-bond layer is bonded on the second side of the device substrate. The first carrier substrate is removed by removing the first de-bond layer. A width of the device substrate remains the first width after removing the first carrier substrate.

Abstract: The present application discloses an interface transformer. The interface transformer includes a first clock generator, a combinational circuit, and a second clock generator. The first clock generator generates an intermediate clock signal according to an input clock signal. A rising edge of the input clock signal precedes a rising edge of the intermediate clock signal, and a falling edge of the intermediate clock signal precedes a falling edge of the input clock signal. The combinational circuit generates a mask clock signal by delaying the intermediate clock signal. The second clock generator generates a transformed clock signal according to the input clock signal and the mask clock signal. The transformed clock signal has two pulses within a cycle of the input clock signal.

Abstract: An integrated circuit includes a memory cell array, a row decoder configured to generate a first decoder signal, a column decoder configured to generate a second decoder signal, and an array of write assist circuits coupled to the row and column decoder and the memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell, and generate the output signal in response to a first control signal. The operating voltage corresponds to an output signal. Each write assist circuit includes an AND gate coupled to a programmable voltage tuner. The programmable voltage tuner includes a set of P-type transistors coupled to a first P-type transistor. The set of P-type transistors is coupled together in parallel, and receives a set of select control signals. A first terminal of the first P-type transistor is configured to receive an AND signal from the AND gate.

Abstract: An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

Abstract: An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

Abstract: An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

Abstract: An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

Abstract: An integrated circuit that includes an array of memory cells and an array of write logic cells. The integrated circuit also includes a write address decoder comprising a plurality of write outputs. The array of write logic cells is electrically connected to the plurality of write outputs. The array of write logic cells is electrically connected to the array of memory cells. The array of write logic cells is configured to set an operating voltage of the memory cells.

Abstract: A voltage providing circuit includes a first circuit configured to receive a first input signal and a second input signal and to generate an output signal. The first circuit includes a first transistor configured to switchably couple the second input signal to a first node responsive to the first input signal, a second transistor having a gate terminal coupled with the first node, and a third transistor having a source terminal coupled with a source terminal of the second transistor. The third transistor is configured to set a reference voltage value at the source terminal of the second transistor if the first input signal indicates that the second input signal is pulled from a first voltage value toward a second voltage value and if the second input signal reaches a predetermined voltage value. A second circuit is configured to receive the output signal and to generate an output voltage.

Abstract: A circuit includes a tracking bit line, a first capacitive circuit, a tracking circuit and a detection circuit. The first capacitive circuit is coupled to the tracking bit line. The first capacitive circuit has a capacitive load on the tracking bit line. The tracking circuit is coupled to the tracking bit line. The tracking circuit being configured to charge or discharge a voltage on the tracking bit line based on a first control signal or the capacitive load. The detection circuit is coupled to the tracking bit line, and is configured to generate a SAE signal responsive to the voltage of the tracking bit line and an inverted first control signal.

Abstract: A circuit includes a tracking bit line, a first capacitive circuit, a tracking circuit and a detection circuit. The first capacitive circuit is coupled to the tracking bit line. The first capacitive circuit has a capacitive load on the tracking bit line. The tracking circuit is coupled to the tracking bit line. The tracking circuit being configured to charge or discharge a voltage on the tracking bit line based on a first control signal or the capacitive load. The detection circuit is coupled to the tracking bit line, and is configured to generate a SAE signal responsive to the voltage of the tracking bit line and an inverted first control signal.

Abstract: A circuit includes a tracking bit line, a tracking unit connected to the tracking bit line and a detection unit. The tracking unit is configured to receive a first control signal and configured to selectively charge or discharge a voltage on the tracking bit line in response to the first control signal. The detection unit is coupled to the tracking bit line and configured to generate a sense amplifier enable (SAE) signal in response to the voltage level on the tracking bit line.

Abstract: A memory includes a plurality of bit cells. Each bit cell includes a bit line and a storage cell coupled to the bit line. A header PMOS transistor is coupled to the storage cell in each bit cell. The header PMOS transistor is at least partially turned off during a write operation by a header control signal.

Abstract: One or more techniques or systems for designing a cell are provided. The cell generally includes one or more transistors, such as a pass gate transistor, a pull up transistor, or a pull down transistor, respectively associated one or more gate to gate distances. In some embodiments, a second gate to gate distance is selected based on a first gate to gate distance. For example, the first gate to gate distance and the second gate to gate distance are associated with a first transistor. In another example, the first gate to gate distance is associated with a first transistor and the second gate to gate distance is associated with a second transistor. In this manner, a cell design is provided to improve a static noise margin (SNM) or a write margin (WM) for the cell, for example.

Abstract: A voltage providing circuit includes a first circuit configured to receive a first input signal and a second input signal and to generate an output signal. The first circuit includes a first transistor configured to switchably couple the second input signal to a first node responsive to the first input signal, a second transistor having a gate terminal coupled with the first node, and a third transistor having a source terminal coupled with a source terminal of the second transistor. The third transistor is configured to set a reference voltage value at the source terminal of the second transistor if the first input signal indicates that the second input signal is pulled from a first voltage value toward a second voltage value and if the second input signal reaches a predetermined voltage value. A second circuit is configured to receive the output signal and to generate an output voltage.

Abstract: A wake up circuit includes a bias signal control block configured to receive a sleep signal and to generate a plurality of bias control signals. The wake up circuit further includes a bias supply block configured to receive each bias control signal of the plurality of bias control signals and to generate a header bias signal. The bias supply block includes a first bias stage configured to receive a first bias control signal of the plurality of bias control signals, and to control the header bias signal to be equal to a first voltage. The bias supply block further includes a second bias stage configured to receive a second bias control signal of the plurality of bias control signals, and to control the header bias signal to be equal to a second voltage different from the first voltage. The wake up circuit further includes a header configured to receive the header bias signal, and to selectively connect a supply voltage to a load based on the header bias signal.