Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: A frame device includes a back board, a buckle member and a casing. The back board has a groove. The buckle member is disposed on the back board, and has a first part member and the second part member disposed corresponding to the groove, and a distance between the first part member and the second part member varies along a direction. The casing is provided with a hook having a first engaging part and a second engaging part, and a distance between the first engaging part and the second engaging part varies along the direction. The first part member is engaged with the first engaging part, and the second part member is engaged with the second engaging part.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A display device is provided. The display device includes: a frame, a panel, and a conductive adhesive. The panel is bonded to the frame via the conductive adhesive. The panel further includes a back plate and a conductive component, wherein the conductive adhesive is electrically connected to the back plate via the conductive component.

Abstract: A display device is provided. The display device includes: a frame, a panel, and a conductive adhesive. The panel is bonded to the frame via the conductive adhesive. The panel further includes a back plate and a conductive component, wherein the conductive adhesive is electrically connected to the back plate via the conductive component.

Abstract: A display device is provided, comprising a display panel, a backlight module and a housing. The display panel and the backlight module are disposed in the housing. The housing includes a frame, a rear plate and a plurality of assembling modules for assembling the frame and the rear plate. One of the assembling modules includes an engaging structure disposed on the frame and an accommodating hole. The engaging structure includes a base, a first positioning element and a second positioning element, wherein the first positioning element and the second positioning element are disposed on the base. The accommodating hole is disposed at the sides of the rear plate and corresponding to the second positioning element of the engaging structure.

Abstract: A display device is provided, comprising a display panel, a backlight module and a housing. The display panel and the backlight module are disposed in the housing. The housing includes a frame, a rear plate and a plurality of assembling modules for assembling the frame and the rear plate. One of the assembling modules includes an engaging structure disposed on the frame and an accommodating hole. The engaging structure includes a base, a first positioning element and a second positioning element, wherein the first positioning element and the second positioning element are disposed on the base. The accommodating hole is disposed at the sides of the rear plate and corresponding to the second positioning element of the engaging structure.

Abstract: A two dimensional/three dimensional (2D/3D) switchable display module, comprising a display panel, an optical module and a revising circuit is disclosed. The display panel has an active area. The optical module is disposed on the active area for changing a light path of a light emitting from the active area. A relative position information is between a position of the optical module and a position of the display panel. The revising circuit is used for providing a revising information based on the relative position information. The display panel receives the revising information and outputs an image corresponding to the optical module for displaying a three dimensional image.

Abstract: A two dimensional/three dimensional (2D/3D) switchable display module, comprising a display panel, an optical module and a revising circuit is disclosed. The display panel has an active area. The optical module is disposed on the active area for changing a light path of a light emitting from the active area. A relative position information is between a position of the optical module and a position of the display panel. The revising circuit is used for providing a revising information based on the relative position information. The display panel receives the revising information and outputs an image corresponding to the optical module for displaying a three dimensional image.

Abstract: A direct type backlight module and an application thereof are described. The direct type backlight module comprises a rear frame module and a light source, wherein the light source is deposed on the rear frame module. The rear frame module comprises a plurality of frameworks, wherein the frameworks are combined to form a frame. The direct type backlight module is suitable for applying in a liquid crystal display (LCD) device.