Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.

Abstract: An apparatus and method for compensation of central wavelength shifting of a fiber grating by material with Invar effect. In the present invention, a substrate having a negative thermal expansion coefficient and a fiber with fiber grating is provided, and two portions of the fiber at both sides of the fiber grating are fixed to the substrate. The substrate and the fiber are satisfied with ?eff?bragg=K?AfEf(?c??f) in which ?eff is an effective thermal expansion coefficient of the fiber grating, ?bragg is a Bragg wavelength, K? is a constant, Af is a cross-section area of the fiber, Ef is an elastic modulus of the fiber, ?c is the negative thermal expansion coefficient of the substrate, and ?f is a thermal expansion coefficient of the fiber.

Abstract: An automatic device for assembling a fiber collimator. The fiber collimator includes a transparent tubular holder, an optical fiber having a first end surface disposed at an end of the tubular holder, and a GRIN lens having a second end surface disposed at the other end of the tubular holder. The automatic device includes an image pick-up device, a processor, a first driving table for rotating and moving the optical fiber, and a second driving table for rotating and moving the GRIN lens. The image pick-up device films the first and second end surfaces, and outputs image data corresponding to the first and second end surfaces. The processor receives and processes the image data to control the first and second driving table to rotate so that the first and second end surfaces are parallel to each other, and control the first and second driving table to move so that a distance between the first and second end surfaces is equal to a predetermined value.

Abstract: An apparatus and method for compensation of central wavelength shifting of a fiber grating by material with Invar effect. In the present invention, a substrate having a negative thermal expansion coefficient and a fiber with fiber grating is provided, and two portions of the fiber at both sides of the fiber grating are fixed to the substrate.

Abstract: An automatic device for assembling a fiber collimator. The fiber collimator includes a transparent tubular holder, an optical fiber having a first end surface disposed at an end of the tubular holder, and a GRIN lens having a second end surface disposed at the other end of the tubular holder. The automatic device includes an image pick-up device, a processor, a first driving table for rotating and moving the optical fiber, and a second driving table for rotating and moving the GRIN lens. The image pick-up device films the first and second end surfaces, and outputs image data corresponding to the first and second end surfaces. The processor receives and processes the image data to control the first and second driving table to rotate so that the first and second end surfaces are parallel to each other, and control the first and second driving table to move so that a distance between the first and second end surfaces is equal to a predetermined value.