Patents by Inventor I-Han Wu

I-Han Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10586789
    Abstract: A micro LED display panel with enhanced display properties includes a substrate, a plurality of micro LEDs on the substrate, at least one common electrode, and a plurality of contact electrodes. Each micro LED includes top and bottom ends and a sidewall between them. The common electrode is coupled to the top end and a contact electrode is coupled to the bottom end. An adjustment electrode insulated from the other electrodes is formed on the sidewall of each of the plurality of micro LEDs; the adjustment electrode being fed with a DC voltage creates an electric field limiting the direction of flow of charge carriers within each micro LED and thereby improving performance.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: March 10, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: I-Wei Wu, Wei-Chih Chang, Chung-Wen Lai, Sheng-Han Li
  • Publication number: 20200058617
    Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. The first bonding structure contacts a first interconnect structure of the first IC die and a second interconnection structure of the second IC die, and has a first portion and a second portion hybrid bonded together. A third IC die is bonded to the second IC die by a third bonding structure. The third bonding structure comprises a second TSV (through substrate via) disposed through the second substrate of the second IC die and includes varies bonding structures according to varies embodiments of the invention.
    Type: Application
    Filed: August 15, 2018
    Publication date: February 20, 2020
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih Han Huang, I-Nan Chen
  • Patent number: 10522349
    Abstract: A method includes depositing a target layer over a substrate; reducing a reflection of a light incident upon the target layer by implanting ions into the target layer, resulting in an ion-implanted target layer; coating a photoresist layer over the ion-implanted target layer; exposing the photoresist layer to the light using a photolithography process, wherein the target layer reduces reflection of the light at an interface between the ion-implanted target layer and the photoresist layer during the photolithography process; developing the photoresist layer to form a resist pattern; etching the ion-implanted target layer with the resist pattern as an etch mask; processing the substrate using at least the etched ion-implanted target layer as a process mask; and removing the etched ion-implanted target layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: December 31, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Han Yang, Tsung-Han Wu, Chih-Wei Chang, Hsin-mei Lin, I-Chun Hsieh, Hsi-Yen Chang
  • Publication number: 20190164745
    Abstract: A method includes depositing a target layer over a substrate; reducing a reflection of a light incident upon the target layer by implanting ions into the target layer, resulting in an ion-implanted target layer; coating a photoresist layer over the ion-implanted target layer; exposing the photoresist layer to the light using a photolithography process, wherein the target layer reduces reflection of the light at an interface between the ion-implanted target layer and the photoresist layer during the photolithography process; developing the photoresist layer to form a resist pattern; etching the ion-implanted target layer with the resist pattern as an etch mask; processing the substrate using at least the etched ion-implanted target layer as a process mask; and removing the etched ion-implanted target layer.
    Type: Application
    Filed: October 31, 2018
    Publication date: May 30, 2019
    Inventors: Cheng-Han Yang, Tsung-Han Wu, Chih-Wei Chang, Hsin-mei Lin, I-Chun Hsieh, Hsi-Yen Chang
  • Patent number: 8786074
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8786073
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8679873
    Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: March 25, 2014
    Assignee: TrueLight Corp.
    Inventors: Jin Shan Pan, Cheng Ju Wu, I Han Wu, Kuo Fong Tseng
  • Patent number: 8324722
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: December 4, 2012
    Assignee: Truelight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Publication number: 20110121323
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Application
    Filed: January 14, 2010
    Publication date: May 26, 2011
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Publication number: 20110086449
    Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.
    Type: Application
    Filed: December 11, 2009
    Publication date: April 14, 2011
    Inventors: Jin Shan Pan, Cheng Ju Wu, I Han Wu, Kuo Fong Tseng
  • Patent number: 6853771
    Abstract: An apparatus and method for compensation of central wavelength shifting of a fiber grating by material with Invar effect. In the present invention, a substrate having a negative thermal expansion coefficient and a fiber with fiber grating is provided, and two portions of the fiber at both sides of the fiber grating are fixed to the substrate. The substrate and the fiber are satisfied with ?eff?bragg=K?AfEf(?c??f) in which ?eff is an effective thermal expansion coefficient of the fiber grating, ?bragg is a Bragg wavelength, K? is a constant, Af is a cross-section area of the fiber, Ef is an elastic modulus of the fiber, ?c is the negative thermal expansion coefficient of the substrate, and ?f is a thermal expansion coefficient of the fiber.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: February 8, 2005
    Inventors: Hsi-Hsun Tsai, Ren-Jet Yao, I-Han Wu, Winyann Jang
  • Patent number: 6718090
    Abstract: An automatic device for assembling a fiber collimator. The fiber collimator includes a transparent tubular holder, an optical fiber having a first end surface disposed at an end of the tubular holder, and a GRIN lens having a second end surface disposed at the other end of the tubular holder. The automatic device includes an image pick-up device, a processor, a first driving table for rotating and moving the optical fiber, and a second driving table for rotating and moving the GRIN lens. The image pick-up device films the first and second end surfaces, and outputs image data corresponding to the first and second end surfaces. The processor receives and processes the image data to control the first and second driving table to rotate so that the first and second end surfaces are parallel to each other, and control the first and second driving table to move so that a distance between the first and second end surfaces is equal to a predetermined value.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: April 6, 2004
    Inventors: Win-Yann Jang, Hai-Haun Tsai, I-Han Wu
  • Publication number: 20030091285
    Abstract: An apparatus and method for compensation of central wavelength shifting of a fiber grating by material with Invar effect. In the present invention, a substrate having a negative thermal expansion coefficient and a fiber with fiber grating is provided, and two portions of the fiber at both sides of the fiber grating are fixed to the substrate.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 15, 2003
    Applicant: UCONN TECHNOLOGY INC.
    Inventors: Hsi-Hsun Tsai, Ren-Jet Yao, I-Han Wu, Winyann Jang
  • Publication number: 20020181865
    Abstract: An automatic device for assembling a fiber collimator. The fiber collimator includes a transparent tubular holder, an optical fiber having a first end surface disposed at an end of the tubular holder, and a GRIN lens having a second end surface disposed at the other end of the tubular holder. The automatic device includes an image pick-up device, a processor, a first driving table for rotating and moving the optical fiber, and a second driving table for rotating and moving the GRIN lens. The image pick-up device films the first and second end surfaces, and outputs image data corresponding to the first and second end surfaces. The processor receives and processes the image data to control the first and second driving table to rotate so that the first and second end surfaces are parallel to each other, and control the first and second driving table to move so that a distance between the first and second end surfaces is equal to a predetermined value.
    Type: Application
    Filed: May 28, 2002
    Publication date: December 5, 2002
    Applicant: U-CONN TECHNOLOGY INC.
    Inventors: Win-Yann Jang, Hsi-Hsun Tsai, I-Han Wu