Patents by Inventor I-Heng Chou

I-Heng Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectromechanical system device
    Patent number: 10266391
    Abstract: A microelectromechanical system (MEMS) device includes a processing die, a MEMS die and a plurality of wires. The MEMS die includes a substrate and a MEMS element. The substrate has a first surface, and the first surface includes a circuit and a plurality of first conductive contacts electrically connected with the circuit. The MEMS element has a second surface, a third surface and at least one second conductive contact, wherein the MEMS element is disposed on the first surface of the substrate with the second surface facing the substrate, and the at least one second conductive contact is disposed on the third surface of the MEMS element. The wires electrically connect the substrate and the MEMS element of the MEMS die to the processing die through the first conductive contacts and the second conductive contact respectively.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: April 23, 2019
    Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD
    Inventors: I-Heng Chou, Li-Tien Tseng, Chih-Liang Kuo
  • MICROELECTROMECHANICAL SYSTEM DEVICE
    Publication number: 20180208457
    Abstract: A microelectromechanical system (MEMS) device includes a processing die, a MEMS die and a plurality of wires. The MEMS die includes a substrate and a MEMS element. The substrate has a first surface, and the first surface includes a circuit and a plurality of first conductive contacts electrically connected with the circuit. The MEMS element has a second surface, a third surface and at least one second conductive contact, wherein the MEMS element is disposed on the first surface of the substrate with the second surface facing the substrate, and the at least one second conductive contact is disposed on the third surface of the MEMS element. The wires electrically connect the substrate and the MEMS element of the MEMS die to the processing die through the first conductive contacts and the second conductive contact respectively.
    Type: Application
    Filed: January 23, 2018
    Publication date: July 26, 2018
    Inventors: I-Heng Chou, Li-Tien Tseng, Chih-Liang Kuo