Patents by Inventor I Hsing WENG

I Hsing WENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD WITH VIA CAPACITOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
    Publication number: 20170367183
    Abstract: A circuit board with via capacitor structure is introduced herein, including a base, a deposition layer, disposed on the base, having at least a via in the deposition layer, at least a thin film capacitor, each thin film capacitor disposed in each via, each thin film capacitor having a body, a second terminal, and a first terminal, the second terminal and the first terminal located on two opposite sides of the body; at least a first electrode, each first electrode electrically connected to the first terminal of each thin film capacitor; and at least a second electrode, each second electrode electrically connected to the second terminal of each thin film capacitor.
    Type: Application
    Filed: January 12, 2017
    Publication date: December 21, 2017
    Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Wen Tsung LI, Kai Chieh HSIEH, I Hsing WENG