Abstract: A light emitting diode structure includes a substrate, a chip on a top surface of the substrate, transparent cup walls on the top surface of the substrate and surround the chip, a wavelength conversion layer covering the chip between the transparent cup walls, and a reflective layer on the wavelength conversion layer. The reflective layer includes a curved bottom surface protruding toward the chip and directly contacting a top surface of the wavelength conversion layer. An edge of the reflective layer directly contacts the transparent cup walls and the wavelength conversion layer. The wavelength conversion layer fills a space defined by the substrate, the transparent cup walls and the reflective layer such that a bottom surface, a side surface, and the top surface of the wavelength conversion layer directly contacts the substrate, the transparent cup walls, and the reflective layer, respectively.

Abstract: A light emitting diode structure includes a substrate, a chip disposed on the substrate, a transparent cup wall surrounding the chip disposed on the substrate, a wavelength conversion layer between the transparent cup wall covering the chip, and a reflective layer disposed on the wavelength conversion layer, in which the reflective layer includes a curved bottom surface protruding toward the chip.

Abstract: A light source device in the present invention includes a substrate, a light-emitting chip, a transparent sealant, and a top cover. The substrate has a supporting surface. The light-emitting chip is disposed on the supporting surface. The transparent sealant covers the light-emitting chip and is located on the supporting surface. The transparent sealant has a light-emitting surface located outside a side surface of the light-emitting chip. The top cover covers a side of the transparent sealant opposite to the substrate, and clamps the transparent sealant together with the substrate, and the light-emitting surface is located between the substrate and the top cover. A reflectance of the top cover is greater than a transmittance of the top cover, and the transmittance of the top cover is greater than 0.1%.

Abstract: A pixel light emitting device including a substrate, a plurality of light emitting elements and a shading layer disposed around each of the light emitting elements is provided. Each of the light emitting elements includes a first electrode layer disposed on the substrate, a second electrode layer not contacting with the first electrode layer, a first semiconductor layer disposed on the first electrode layer, a second semiconductor layer disposed on the second electrode layer and covering the first semiconductor layer, a light emitting layer disposed on the second semiconductor layer, a third semiconductor layer disposed on the light emitting layer, and at least one first penetrator, which penetrates the light emitting layer and the second semiconductor layer to form an electrical connection between the first semiconductor layer and the third semiconductor layer.

Abstract: A pixel light emitting device including a substrate, a plurality of light emitting elements and a shading layer disposed around each of the light emitting elements is provided. Each of the light emitting elements includes a first electrode layer disposed on the substrate, a second electrode layer not contacting with the first electrode layer, a first semiconductor layer disposed on the first electrode layer, a second semiconductor layer disposed on the second electrode layer and covering the first semiconductor layer, a light emitting layer disposed on the second semiconductor layer, a third semiconductor layer disposed on the light emitting layer, and at least one first penetrator, which penetrates the light emitting layer and the second semiconductor layer to form an electrical connection between the first semiconductor layer and the third semiconductor layer.

Abstract: A light source device in the present invention includes a substrate, a light-emitting chip, a transparent sealant, and a top cover. The substrate has a supporting surface. The light-emitting chip is disposed on the supporting surface. The transparent sealant covers the light-emitting chip and is located on the supporting surface. The transparent sealant has a light-emitting surface located outside a side surface of the light-emitting chip. The top cover covers a side of the transparent sealant opposite to the substrate, and clamps the transparent sealant together with the substrate, and the light-emitting surface is located between the substrate and the top cover. A reflectance of the top cover is greater than a transmittance of the top cover, and the transmittance of the top cover is greater than 0.1%.