Abstract: A method for manufacturing circuit board, including: providing a substrate; printing a first conductive layer on a surface of the substrate, the first conductive layer includes a plurality of electrode units arranged in an M*N array, each of the electrode units includes a first electrode, and a plurality of second electrodes distributed around the first electrode; printing a first insulating layer on a side of the first conductive layer away from the substrate; printing a second conductive layer on a side of the first insulating layer away from the substrate; printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode. A circuit board is also provided.

Abstract: A method for manufacturing circuit board, including: providing a substrate; printing a first conductive layer on a surface of the substrate, the first conductive layer includes a plurality of electrode units arranged in an M*N array, each of the electrode units includes a first electrode, and a plurality of second electrodes distributed around the first electrode; printing a first insulating layer on a side of the first conductive layer away from the substrate; printing a second conductive layer on a side of the first insulating layer away from the substrate; printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode. A circuit board is also provided.

Abstract: A noise reduction structure of a button assembly including a keycap, a trigger portion, a circuit board, and an elastic piece includes an extension portion, a buffer portion, and an abutting portion. The extension portion extends from the keycap toward the abutting portion. The buffer portion is mounted to at least one of the extension portion or the abutting portion and is located between the extension portion and the abutting portion. When the keycap is pressed, the extension portion is moved away from the abutting portion, the trigger portion presses the elastic piece to deform the elastic piece, and the elastic piece contacts the circuit board. When the keycap is released, a restoring force of the elastic piece drives the extension portion to move toward the abutting portion, and the buffer portion buffers contact between the abutting portion and the extension portion.