Patents by Inventor I-Hui Chiu

I-Hui Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110117326
    Abstract: A three-dimensional print film structure is applicable to in-mold injection-molded decoration. The three-dimensional print film structure comprises a film, a three-dimensional printing layer, a releasing layer, a pattern layer, an impact-resistant layer and a thermal tolerance bonding adhesive. The film has a first surface and a second surface. The three-dimensional printing layer is disposed on the first surface. The releasing layer is disposed on the second surface. The pattern layer is disposed on one side of the releasing layer. The impact-resistant layer is disposed on one side of the pattern layer. The thermal tolerance bonding adhesive is disposed on one side of the impact-resistant layer. When a mold is closed, the three-dimensional printing layer can form a three-dimensional patterned decoration on a plastic material so as to provide an aesthetic effect.
    Type: Application
    Filed: November 16, 2009
    Publication date: May 19, 2011
    Inventors: Sou-Kuein Chiu, I-Hui Chiu