Patents by Inventor I-Jang TENG

I-Jang TENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11832371
    Abstract: The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: November 28, 2023
    Assignee: INPAQ TECHNOLOGY CO., LTD.
    Inventors: I-Jang Teng, Chun Peng Lin, Hsiu Lun Yeh
  • Publication number: 20230156897
    Abstract: The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.
    Type: Application
    Filed: February 17, 2022
    Publication date: May 18, 2023
    Inventors: I-Jang TENG, Chun Peng LIN, Hsiu Lun YEH