Abstract: A smart grid integration system includes an AC grid and at least one power conversion apparatus. The power conversion apparatus includes a control unit and a communication unit. The control unit is coupled to the communication unit and receives a voltage signal corresponding to a voltage of the AC grid. The control unit decomposes the voltage signal into a plurality of frequency components and sets a fundamental component and a plurality of dominant harmonic components as a voltage operation signal. The communication unit receives a current signal corresponding to a current flowing through a circuit node through a current port and generates a current information signal. The communication unit receives the voltage operation signal transmitted from the control unit and calculates power information by multiplying the voltage operation signal and the current information signal.

Abstract: An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation component disposed between the main body and the resilient component, connected with the resilient component and covering the surface of the apertures. When the temperature of the electronic apparatus is increased, the resilient component expands and bends outward so as to carry the insulation component apart from the surface of the apertures and further form a space, thereby enabling air to flow through the apertures of the electronic apparatus and the space to dissipate heat of the electronic apparatus.

Abstract: An electronic apparatus having a function of receiving a power cord is disclosed. The electronic apparatus having a function of receiving a power cord comprises a main body, a power cord and at least a receiving element. The power cord is connected to a first side of the main body, and the receiving element is disposed on a second side of the main body and has a base plate and two boards. The two boards are respectively connected to two opposite sides of the base plate for allowing the power cord to be wound around the electronic apparatus and received at a receiving space formed between the two boards.

Abstract: An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation component disposed between the main body and the resilient component, connected with the resilient component and covering the surface of the apertures. When the temperature of the electronic apparatus is increased, the resilient component expands and bends outward so as to carry the insulation component apart from the surface of the apertures and further form a space, thereby enabling air to flow through the apertures of the electronic apparatus and the space to dissipate heat of the electronic apparatus.

Abstract: An electronic apparatus having a function of receiving a power cord is disclosed. The electronic apparatus having a function of receiving a power cord comprises a main body, a power cord and at least a receiving element. The power cord is connected to a first side of the main body, and the receiving element is disposed on a second side of the main body and has a base plate and two boards. The two boards are respectively connected to two opposite sides of the base plate for allowing the power cord to be wound around the electronic apparatus and received at a receiving space formed between the two boards.

Abstract: An electronic apparatus capable of receiving a power cord is disclosed. The electronic apparatus comprises a main body, a power cord connected to the main body in one end, and a plurality of receiving elements having a specific height and respectively disposed on the main body of the electronic apparatus, and thereby allowing the power cord to be entwined and received between the receiving elements.

Abstract: A heat-dissipating casing of an electronic apparatus having an input device, an output device, and a printed circuit board connected with the input device and the output device is disclosed. The heat-dissipating casing includes a metal extruded casing having at least four surfaces to form a space, a first opening and a second opening, wherein the space is used for receiving the printed circuit board, a first side plate fixed to the metal extruded casing to cover the first opening and having a first hole for securing the input device, and a second side plate fixed to the metal extruded casing to cover the second opening and having a second hole for securing the output device, thereby dissipating the heat generated from the electronic apparatus and equalizing the surface temperature of the electronic apparatus.

Abstract: A heat-dissipating casing of an electronic apparatus having an input device, an output device, and a printed circuit board connected with the input device and the output device is disclosed. The heat-dissipating casing includes a metal extruded casing having at least four surfaces to form a space, a first opening and a second opening, wherein the space is used for receiving the printed circuit board, a first side plate fixed to the metal extruded casing to cover the first opening and having a first hole for securing the input device, and a second side plate fixed to the metal extruded casing to cover the second opening and having a second hole for securing the output device, thereby dissipating the heat generated from the electronic apparatus and equalizing the surface temperature of the electronic apparatus.

Abstract: A casing structure for an electronic apparatus is disclosed. The casing structure includes a main body to be placed on a surface of an object, and at least one sucker disposed on at least one side of the main body, thereby attaching the electronic apparatus on the surface to prevent the electronic apparatus from moving relative to the surface of the object.