Patents by Inventor I-Kai Liang

I-Kai Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly method of electronic device
    Patent number: 12096568
    Abstract: The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanism on a circuit board, in which the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board; snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portion of the elastic sheet; and closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: September 17, 2024
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventor: I-Kai Liang
  • ASSEMBLY METHOD OF ELECTRONIC DEVICE
    Publication number: 20230292444
    Abstract: The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanism on a circuit board, in which the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board; snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portion of the elastic sheet; and closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.
    Type: Application
    Filed: June 2, 2022
    Publication date: September 14, 2023
    Inventor: I-Kai Liang