Patents by Inventor I-Kai Lin

I-Kai Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMBINED POWER MODULE
    Publication number: 20240130055
    Abstract: This disclosure relates to a combined power module that includes a base structure, a terminal structure, a second terminal, and a cover. The terminal structure includes a mount assembly and a plurality of first terminals. The mount assembly is assembled on the base structure. The first terminals are disposed on the mount assembly. The second terminal is disposed on the base structure. The cover is disposed on the base structure and covers at least part of the first terminals and at least part of the second terminal.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Cheng HUANG, I-Hung CHIANG, Ji-Yuan SYU, Hsin-Han LIN, Po-Kai CHIU, Kuo-Shu KAO
  • System and method for ventilation in the fabrication of integrated circuits
    Patent number: 7033442
    Abstract: In the fabrication of semiconductor integrated circuits, a ventilation system is disclosed which includes a sleeve device, a ventilator and a sensor. The sleeve device has at least one aperture thereon for gas transfer. The ventilator is coupled to the sleeve device. The sensor is coupled to the sleeve device. A method of ventilation is also disclosed, which includes a step of sensing a relative movement between a sleeve having at least aperture for gas transfer and a gas outlet connected to a pipeline, and a step of generating a signal to control a ventilator when the relative movement between the sleeve and the gas outlet is sensed.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: April 25, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: I-Kai Lin, Jia-Rong Chen
  • System and method for ventilation in the fabrication of integrated circuits
    Publication number: 20050092436
    Abstract: In the fabrication of semiconductor integrated circuits, a ventilation system is disclosed which includes a sleeve device, a ventilator and a sensor. The sleeve device has at least one aperture thereon for gas transfer. The ventilator is coupled to the sleeve device. The sensor is coupled to the sleeve device. A method of ventilation is also disclosed, which includes a step of sensing a relative movement between a sleeve having at least aperture for gas transfer and a gas outlet connected to a pipeline, and a step of generating a signal to control a ventilator when the relative movement between the sleeve and the gas outlet is sensed.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Inventors: I-Kai Lin, Jia-Rong Chen