Patents by Inventor I-Kuo Lin

I-Kuo Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Extremely thin package
    Patent number: 9735018
    Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: August 15, 2017
    Assignee: Silego Technology, Inc.
    Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin
  • EXTREMELY THIN PACKAGE
    Publication number: 20150364331
    Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.
    Type: Application
    Filed: August 24, 2015
    Publication date: December 17, 2015
    Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin
  • Extremely thin package
    Patent number: 9147629
    Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: September 29, 2015
    Assignee: Silego Technology, Inc.
    Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin
  • EXTREMELY THIN PACKAGE
    Publication number: 20140084429
    Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 27, 2014
    Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin