Patents by Inventor I-Lin TSENG
I-Lin TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11134574Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.Type: GrantFiled: October 9, 2018Date of Patent: September 28, 2021Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: I-Lin Tseng, Tzu-Chun Chen
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Patent number: 10781982Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.Type: GrantFiled: April 27, 2018Date of Patent: September 22, 2020Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, I-Lin Tseng, Po-Cheng Huang, Hui-Ju Yang
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Publication number: 20190045638Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.Type: ApplicationFiled: October 9, 2018Publication date: February 7, 2019Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: I Lin Tseng, Tzu Chun Chen
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Patent number: 10098242Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.Type: GrantFiled: March 28, 2013Date of Patent: October 9, 2018Assignee: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: I Lin Tseng, Tzu Chun Chen
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Publication number: 20180245749Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.Type: ApplicationFiled: April 27, 2018Publication date: August 30, 2018Applicant: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung YI, I-Lin TSENG, Po-Cheng HUANG, Hui-Ju YANG
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Patent number: 9976709Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.Type: GrantFiled: May 10, 2016Date of Patent: May 22, 2018Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, I-Lin Tseng, Po-Cheng Huang, Hui-Ju Yang
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Publication number: 20160334067Abstract: A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.Type: ApplicationFiled: May 10, 2016Publication date: November 17, 2016Applicant: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung YI, I-Lin TSENG, Po-Cheng HUANG, Hui-Ju YANG
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Publication number: 20150060128Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.Type: ApplicationFiled: March 28, 2013Publication date: March 5, 2015Inventors: I Lin Tseng, Tzu Chun Chen
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Publication number: 20140014401Abstract: A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.Type: ApplicationFiled: July 12, 2012Publication date: January 16, 2014Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Pen-Yi LIAO, Ming-Chun WU, I-Lin TSENG, Tsung-Han WU, Jung-Chi LIN