Patents by Inventor I-Ling Chen

I-Ling Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260194403
    Abstract: A probe cover delivery device includes a probe cover delivery base, a probe cover pushing assembly and a probe cover accommodating accessory. The probe cover pushing assembly is disposed on the probe cover delivery base, and the probe cover accommodating accessory is disposed on the probe cover delivery base. The probe cover pushing assembly includes a first probe cover pushing element and a second probe cover pushing element, the first probe cover pushing element has a first supporting portion and a first pushing portion disposed on the first supporting portion. The second probe cover pushing element has a second supporting portion and a second pushing portion disposed on the first supporting portion. The ear thermometer probe cover can be pushed by the first pushing portion and the second pushing portion to fall from the probe cover accommodating portion to the base body of the probe cover delivery base.
    Type: Application
    Filed: January 3, 2025
    Publication date: July 9, 2026
    Inventors: TSENG-LUNG LIN, I-LING CHEN
  • Patent number: 12571685
    Abstract: A temperature measuring device is configured for measuring a predetermined object by a temperature measurement module. The temperature measuring device includes a device main body having a hollow probe structure. An outer surface of the hollow probe structure has a plurality of recessed spaces recessed therefrom and a plurality of concave areas respectively formed in the recessed spaces. When the hollow probe structure of the device main body directly or indirectly contacts the predetermined object, the recessed spaces of the hollow probe structure are configured to reduce a heat conduction path between the hollow probe structure and the predetermined object. When the hollow probe structure of the device main body directly or indirectly contacts the predetermined object, the concave areas of the hollow probe structure do not contact the predetermined object, so as to reduce a heat exchange area between the hollow probe structure and the predetermined object.
    Type: Grant
    Filed: May 28, 2023
    Date of Patent: March 10, 2026
    Assignee: RADIANT INNOVATION INC.
    Inventors: Tseng-Lung Lin, I-Ling Chen, Chin-Hui Ku
  • Patent number: 12567663
    Abstract: A millimeter-wave optical fiber antenna module and a method for manufacturing the same are provided. The millimeter-wave optical fiber antenna module includes a packaging module, an antenna member, and a second encapsulant. The packaging module includes a first circuit substrate, a first placement member, a first chip assembly, a second chip assembly, an optical fiber connector, and a first encapsulant. The first circuit substrate has a top surface and a bottom surface. The first placement member is disposed on the top surface. The first placement member has first grooves, and the first grooves are linear and parallel to one another. The first chip assembly and the second chip assembly are located on the top surface. The first chip assembly is electrically connected to the second chip assembly. The first chip assembly and the second chip assembly respectively include an integrated circuit chip and an integrated optical circuit chip.
    Type: Grant
    Filed: April 3, 2024
    Date of Patent: March 3, 2026
    Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
    Inventors: I-Ling Chen, Yu-Cheng Liu
  • Publication number: 20250246796
    Abstract: A millimeter-wave optical fiber antenna module and a method for manufacturing the same are provided. The millimeter-wave optical fiber antenna module includes a packaging module, an antenna member, and a second encapsulant. The packaging module includes a first circuit substrate, a first placement member, a first chip assembly, a second chip assembly, an optical fiber connector, and a first encapsulant. The first circuit substrate has a top surface and a bottom surface. The first placement member is disposed on the top surface. The first placement member has first grooves, and the first grooves are linear and parallel to one another. The first chip assembly and the second chip assembly are located on the top surface. The first chip assembly is electrically connected to the second chip assembly. The first chip assembly and the second chip assembly respectively include an integrated circuit chip and an integrated optical circuit chip.
    Type: Application
    Filed: April 3, 2024
    Publication date: July 31, 2025
    Inventors: I-LING CHEN, YU-CHENG LIU
  • Publication number: 20250225657
    Abstract: Provided herein is a method of segmenting features from an optical image of a skin comprising steps of receiving an optical image of a skin that contains at least one feature of an object: contrast-enhancing the feature's signals of the optical image from the background signals: segmenting the object in the enhanced optical image, and quantifying the feature from the optical image of the skin.
    Type: Application
    Filed: August 2, 2022
    Publication date: July 10, 2025
    Inventors: I-Ling CHEN, Chih-Wei LU
  • Publication number: 20250084172
    Abstract: The present disclosure relates to a ULBP6 binding protein that inhibits the interaction between ULBP6 and NKG2D, and methods of treating cancer with said ULBP6 binding protein.
    Type: Application
    Filed: July 15, 2024
    Publication date: March 13, 2025
    Applicants: 23andMe, Inc., Glaxosmithkline Intellectual Property (No.3) Ltd
    Inventors: Joel Benjamin, Shashank Bharill, I-Ling Chen, Yu Chen, Wei-Jen Chung, Zahra Bahrami Dizicheh, Germaine Fuh, Patrick Koenig, Yujie Liu, Mauro Poggio, Shruti Yadav, Ping-Chiao Tsai, Claus Spitzfaden
  • Publication number: 20250060355
    Abstract: A biochip for measuring a cell density of target bio-particles in a sample is provided. The biochip includes a spiral electrode pair and a concentric electrode array. The spiral electrode pair includes a first spiral electrode and a second spiral electrode that are parallel to each other and that are spaced apart from each other. Each of the first spiral electrode and the second spiral electrode is shaped in a spiral extending in one of clockwise and counterclockwise directions. The concentric electrode array includes a plurality of arcs that are concentric and extend in a circular direction around the spiral electrode pair.
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Inventors: I-Fang CHENG, Jyun-Hong WANG, I-Ling CHEN, Pin-Ru KE
  • Patent number: 12138011
    Abstract: Provided herein are image registration methods comprising providing a wide view image of a target area by a first imager; providing a narrow view image of the target area by a second imager; aligning the narrow view image on the wide view image of the target area; capturing an optical image by an optical imager, wherein the optical imager is configured to locate the optical image in the narrow view image; and displaying the position of the optical image on the narrow view image and the wide view image of the target area; and the systems thereof.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: November 12, 2024
    Assignee: Apollo Medical Optics, Ltd.
    Inventors: Chih Wei Lu, Sung Wei Lu, Jia-Wei Lin, I-Ling Chen, Tuan Shu Ho
  • Publication number: 20240272009
    Abstract: A temperature measuring device is configured for measuring a predetermined object by a temperature measurement module. The temperature measuring device includes a device main body having a hollow probe structure. An outer surface of the hollow probe structure has a plurality of recessed spaces recessed therefrom and a plurality of concave areas respectively formed in the recessed spaces. When the hollow probe structure of the device main body directly or indirectly contacts the predetermined object, the recessed spaces of the hollow probe structure are configured to reduce a heat conduction path between the hollow probe structure and the predetermined object. When the hollow probe structure of the device main body directly or indirectly contacts the predetermined object, the concave areas of the hollow probe structure do not contact the predetermined object, so as to reduce a heat exchange area between the hollow probe structure and the predetermined object.
    Type: Application
    Filed: May 28, 2023
    Publication date: August 15, 2024
    Inventors: TSENG-LUNG LIN, I-LING CHEN, CHIN-HUI KU
  • Patent number: 12060426
    Abstract: The present disclosure relates to a ULBP6 binding protein that inhibits the interaction between ULBP6 and NKG2D, and methods of treating cancer with said ULBP6 binding protein.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: August 13, 2024
    Assignee: 23andMe, Inc.
    Inventors: Joel Benjamin, Shashank Bharill, I-Ling Chen, Yu Chen, Wei-Jen Chung, Zahra Bahrami Dizicheh, Germaine Fuh, Patrick Koenig, Yujie Liu, Mauro Poggio, Shruti Yadav, Ping-Chiao Tsai, Claus Spitzfaden
  • Patent number: 11808631
    Abstract: An infrared sensor module and a forehead thermometer are provided. The infrared sensor module includes a light guide structure and an infrared sensor element. An annular hollow space is formed inside the light guide structure and passes therethrough. A first and second opening is formed on two opposite sides of the light guide structure, respectively. A diameter of the first opening is greater than a diameter of the second opening. The annular hollow space includes a matte and reflective area, the matte area has serration portions, and each of the serration portions extends from the first opening to the second opening and is arranged parallel to each other. The reflective area is formed between the second opening and the matte area. The infrared sensor element is disposed at the second opening. The forehead thermometer includes a casing, a circuit board, the infrared sensor module, and an operating switch.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: November 7, 2023
    Assignee: RADIANT INNOVATION INC.
    Inventors: Tseng-Lung Lin, I-Ling Chen, Chin-Hui Ku
  • Publication number: 20230348604
    Abstract: The present disclosure relates to a ULBP6 binding protein that inhibits the interaction between ULBP6 and NKG2D, and methods of treating cancer with said ULBP6 binding protein.
    Type: Application
    Filed: April 28, 2023
    Publication date: November 2, 2023
    Applicants: 23andMe, Inc., GLAXOSMITHKLINE INTELLECTUAL PROPERTY (No.3) LIMITED
    Inventors: Joel BENJAMIN, Shashank BHARILL, I-Ling CHEN, Yu CHEN, Wei-Jen CHUNG, Zahra Bahrami DIZICHEH, Germaine FUH, Patrick KOENIG, Yujie LIU, Mauro POGGIO, Shruti YADAV, Ping-Chiao TSAI, Claus SPITZFADEN
  • Patent number: 11761819
    Abstract: A temperature calibration method for an ear thermometer with a probe cover is provided. The temperature calibration method includes: providing the ear thermometer with the probe cover, the ear thermometer including a plurality of activation elements which are configured to sense an infrared transmittance of the probe cover to obtain a measured transmittance value; using the ear thermometer to measure an object to be tested to obtain an uncalibrated temperature; obtaining an infrared radiation energy emitted by the object to be tested, according to the uncalibrated temperature, the measured transmittance value, a preset transmittance value, and a radiation energy measurement formula; and calibrating the uncalibrated temperature to a calibrated temperature, according to a temperature calibration function.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: September 19, 2023
    Assignee: RADIANT INNOVATION INC.
    Inventors: Yung-Chang Chang, Tseng-Lung Lin, I-Ling Chen
  • Patent number: 11639439
    Abstract: A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1): in Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 2, 2023
    Assignee: Prior Company Limited
    Inventors: Yu Lin Huang, I-Ling Chen, Cheng-Hsin Tsai
  • Publication number: 20220411628
    Abstract: A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1): In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.
    Type: Application
    Filed: August 25, 2021
    Publication date: December 29, 2022
    Applicant: Prior Company Limited
    Inventors: Yu Lin Huang, I-Ling Chen, Cheng-Hsin Tsai
  • Publication number: 20220326083
    Abstract: A temperature calibration method for an ear thermometer with a probe cover is provided. The temperature calibration method includes: providing the ear thermometer with the probe cover, the ear thermometer including a plurality of activation elements which are configured to sense an infrared transmittance of the probe cover to obtain a measured transmittance value; using the ear thermometer to measure an object to be tested to obtain an uncalibrated temperature; obtaining an infrared radiation energy emitted by the object to be tested, according to the uncalibrated temperature, the measured transmittance value, a preset transmittance value, and a radiation energy measurement formula; and calibrating the uncalibrated temperature to a calibrated temperature, according to a temperature calibration function.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 13, 2022
    Inventors: YUNG-CHANG CHANG, TSENG-LUNG LIN, I-LING CHEN
  • Publication number: 20220211273
    Abstract: Provided herein are image registration methods comprising providing a wide view image of a target area by a first imager; providing a narrow view image of the target area by a second imager; aligning the narrow view image on the wide view image of the target area; capturing an optical image by an optical imager, wherein the optical imager is configured to locate the optical image in the narrow view image; and displaying the position of the optical image on the narrow view image and the wide view image of the target area; and the systems thereof.
    Type: Application
    Filed: April 30, 2020
    Publication date: July 7, 2022
    Inventors: Chih Wei LU, Sung Wei LU, Jia-Wei LIN, I-Ling CHEN, Tuan Shu HO
  • Publication number: 20220196478
    Abstract: An infrared sensor module and a forehead thermometer are provided. The infrared sensor module includes a light guide structure and an infrared sensor element. An annular hollow space is formed inside the light guide structure and passes therethrough. A first and second opening is formed on two opposite sides of the light guide structure, respectively. A diameter of the first opening is greater than a diameter of the second opening. The annular hollow space includes a matte and reflective area, the matte area has serration portions, and each of the serration portions extends from the first opening to the second opening and is arranged parallel to each other. The reflective area is formed between the second opening and the matte area. The infrared sensor element is disposed at the second opening. The forehead thermometer includes a casing, a circuit board, the infrared sensor module, and an operating switch.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: TSENG-LUNG LIN, I-LING CHEN, CHIN-HUI KU
  • Patent number: 11262183
    Abstract: Provided herein are devices and systems comprising an illumination module configured to provide a source light to an optical interference module, which converts the source light to a line of light and processes light signal; an interference objective module, which handles light from the optical interference module and processes light signal generated from a sample; a two-dimensional camera configured to receive a backscattered interference signal from the sample, and a data processing module which processes the interference signal into an image.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: March 1, 2022
    Assignee: Apollo Medical Optics, Ltd.
    Inventors: Tuan-Shu Ho, I-Ling Chen, Dan Ji, Sung Wei Lu, Tzu Wei Liu, Jen Yu Tseng, Ting Yueh Lin, Chih Wei Lu, Jia-Wei Lin, Yo Cheng Chuang, Sheng-Lung Huang
  • Publication number: 20200271436
    Abstract: Provided herein are devices and systems comprising an illumination module configured to provide a source light to an optical interference module, which converts the source light to a line of light and processes light signal; an interference objective module, which handles light from the optical interference module and processes light signal generated from a sample; a two-dimensional camera configured to receive a backscattered interference signal from the sample, and a data processing module which processes the interference signal into an image.
    Type: Application
    Filed: September 18, 2018
    Publication date: August 27, 2020
    Inventors: Tuan-Shu HO, I-Ling CHEN, Dan JI, Sung Wei LU, Tzu Wei LIU, Jen Yu TSENG, Ting Yueh LIN, Chih Wei LU, Jia-Wei LIN, Yo Cheng CHUANG, Sheng-Lung HUANG