Patents by Inventor I-LING TENG

I-LING TENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180086952
    Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).
    Type: Application
    Filed: November 22, 2016
    Publication date: March 29, 2018
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: I-Ling Teng, Tzu-Ching Hung, Chiao-Pei Chen, Yu-Hsien Lee, Tsung-Tai Hung, Bo-Sheng Wang, Cheng-Yen Hsiao, Chen-Hsin Huang
  • Publication number: 20160088728
    Abstract: An insulation film of a signal transmission line includes a substrate layer, and a bonding layer arranged on the substrate layer for directly covering metal conductors of the signal transmission line, wherein the bonding layer is made of a polyolefin copolymer resin or a polyolefin resin mixture.
    Type: Application
    Filed: November 3, 2014
    Publication date: March 24, 2016
    Inventors: Fu-Min Wang, Tsung-Tai Hung, I-Ling Teng, Feng-Jung Tien, Yu-Hsien Lee, Tzu-Ching Hung
  • Publication number: 20150194553
    Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 9, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: FU-MIN WANG, I-LING TENG, TSUNG-TAI HUNG, YU-HSIEN LEE, TZU-CHING HUNG, CHEN-HSIN HUANG