Abstract: A system for docking an electronic test head with a handling apparatus is provided. The system includes an assembly for at least partially aligning and subsequently bringing together the electronic test head and the handling apparatus. The system also includes a power driven actuator for providing only partially powered assistance in bringing together the electronic test head and the handling apparatus.

Abstract: A system is useful for positioning a load, such as a test head. The system includes an arm which supports the load and which moves along a first vertical axis. The system also includes a rotation unit for rotating the first vertical axis about a second vertical axis spaced apart from the first vertical axis.

Abstract: A system for docking an electronic test head with a handling apparatus is provided. The system includes an assembly for at least partially aligning and subsequently bringing together the electronic test head and the handling apparatus. The system also includes a power driven actuator for providing only partially powered assistance in bringing together the electronic test head and the handling apparatus.

Abstract: A safety lock system prevents unlocking of a balanced loaded unit when the loaded unit becomes unbalanced. A plurality of calipers applies pressure on opposite sides of a guide rail. A lock block couples the load to at least one of the calipers for movement of the load along the guide rail. A rotatable handle is coupled to the calipers through a shaft. Rotation of the handle locks or unlocks the lock block against vertical movement. A safety block is coupled to the loaded unit and is moveable with the loaded unit for preventing rotation of the handle upon a preselected movement of the loaded unit relative to the lock block.

Abstract: A system for docking an electronic test head with a handling apparatus is provided. The system includes an assembly for at least partially aligning and subsequently bringing together the electronic test head and the handling apparatus. The system also includes a power driven actuator for providing only partially powered assistance in bringing together the electronic test head and the handling apparatus.

Abstract: A positioner facilitates docking and undocking of an electronic test head with a device handler. The positioner provides for rotation of the test head about a first axis. The positioner includes a support structure for moving the test head along a second axis orthogonal to the first axis. The support structure accurately docks the electronic test head with the device handler.

Abstract: A positioner facilitates docking and undocking of an electronic test head with a device handler. The positioner provides for rotation of the test head about a first axis. The positioner includes a support structure for moving the test head along a second axis orthogonal to the first axis. The support structure accurately docks the electronic test head with the device handler.

Abstract: A positioner facilitates docking and undocking of an electronic test head with a device handler. The positioner provides for rotation of the test head about a first axis. The positioner includes a linkage arm structure for moving the test head along a second axis orthogonal to the first axis. Using motors, sensors and a processor, the linkage arm structure accurately docks the electronic test head with the device handler.

Abstract: A positioner facilitates docking and undocking of an electronic test head with a device handler. The positioner provides for rotation of the test head about a first axis. The positioner includes a linkage arm structure for moving the test head along a second axis orthogonal to the first axis. Using motors, sensors and a processor, the linkage arm structure accurately docks the electronic test head with the device handler.

Abstract: Apparatus is provided for monitoring conditions of a fine wire interconnection during a bonding operation. The apparatus comprise a system which is capable of being installed on new automatic wire bonders or retrofitted into existing automatic wire bonders of the type which employ a main bonding processor for controlling the motion of the bonding tool. The semiconductor to be bonded is connected to a reference voltage and a variable frequency oscillator is magnetically or a.c. coupled to the fine wire above the bonding tool and below the wire feed. The bonding wire incurs changes in inductive and capacitive reactance during the bonding operation which cause variations in the frequency of the oscillator. A series of frequency samples are taken and recorded during a teaching operation in which good wire bond interconnections are made.

Abstract: Apparatus is provided for monitoring the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. The apparatus comprises a counter for generating a start and stop signal indicative of a predetermined plurality of cycles from the ultrasonic generator of the ultrasonic bonder. A stable source of pulses is applied to a second counter which is started and stopped by the start and stop signal. The count stored in the second counter is read out to a microprocessor and is indicative of the frequency of the ultrasonic generator during the bonding operation. A plurality of frequency readings are taken and measured during the formation of an ultrasonic wedge bond and this information is employed to calculate a bond quality rating which accurately predicts whether a good bond has been made or some condition exists indicating that a good bond has not been made.