Patents by Inventor I-Min Lin

I-Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230186222
    Abstract: The present utility model discloses a production defect and abnormality report and track record retrieval system for the textile industry, which is made up of a textile machine, an information appliance, a server host, and a production track record retrieval platform in the server host can collect, store, integrate, and submit the data in real time, so that the production track record of finished textile products can be retrieved through the production track record retrieval platform, and through the production track record retrieval platform, the user can review the whole production history and defect analysis remotely. Therefore, the production defect and abnormality report and track record retrieval system for the textile industry can significantly enhance work efficiency, reduce defect rate, and enables quick retrieval and transparency of the production track record.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Applicant: TUNTEX INCORPORATION
    Inventor: I-MIN LIN
  • Publication number: 20220243362
    Abstract: This invention relates to an elastic functional textile fabric and dyeing and finishing method thereof. The fabric provided mainly comprises at least one elastic yarn. An ironing machine is used to process the fabric to maintain warp-wise smoothness and flatness. After ironing, a sanforizing machine is used to sanforize the fabric, and then the fabric undergoes a scutching procedure. Then, a setting machine is used to preset the scutched fabric, the fabric undergoes a dyeing procedure to form an elastic fabric. Then, the elastic fabric undergoes a second scutching procedure and a second setting procedure to form the finished product as the elastic functional textile fabric according to this invention. Through the production method disclosed above, problematic situations like insufficient weft weight, unsmooth fabric surface, pitting surface, uneven dyeing, side shading, poor fastness, chromatic aberration, dyelot chromatism, insufficient elasticity, as well as spray burns, etc can be dramatically reduced.
    Type: Application
    Filed: February 4, 2021
    Publication date: August 4, 2022
    Inventor: I-MIN LIN
  • Publication number: 20220074087
    Abstract: The present invention relates generally to a multifunctional textile produced by a special processing method and the manufacturing method and use thereof. The water repellent agent and flame retardant incompatible with each other are laminated by using special materials and a specific processing method to form a multifunctional textile with special water repellency, soil repellency, oil repellency, mildew resistance and flame retardancy, which comprises a base cloth layer, two composite layers and a flame retardant layer. The base cloth layer has a first surface and a second surface opposite to the first surface, the two composite layers are disposed on the first surface and the second surface respectively, and then the flame retardant layer is disposed on the composite layer of the first surface of the base cloth layer.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Inventor: I-MIN LIN
  • Publication number: 20210271224
    Abstract: The present invention relates generally to a Cloud real-time textile intelligent production information management monitoring and prewarning integrated system, which comprises a sensing device, a communication system, a server, a central information integration system and an end device.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 2, 2021
    Inventors: I-MIN LIN, YU-CHENG HUANG, MING-WANG LIN, SHIH-CHEH SUNG, YU-HSIANG SU
  • Patent number: 9426894
    Abstract: A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: August 23, 2016
    Assignee: XINTEC INC.
    Inventors: Yi-Ming Chang, I-Min Lin, Po-Shen Lin
  • Publication number: 20140251946
    Abstract: A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.
    Type: Application
    Filed: May 20, 2014
    Publication date: September 11, 2014
    Applicant: XINTEC INC.
    Inventors: Yi-Ming CHANG, I-Min LIN, Po-Shen LIN
  • Patent number: 8760882
    Abstract: A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: June 24, 2014
    Assignee: Xintec Inc.
    Inventors: Yi-Ming Chang, I-Min Lin, Po-Shen Lin
  • Publication number: 20130180316
    Abstract: A resonant knock sensor includes a housing, a pedestal and a vibration diaphragm. The housing is provided with a support surface therein. The pedestal is fixed in the housing and has a base with a bottom surface attached to the support surface, a support portion protruding from a top surface of the base, and a vibration piece connected to an end of the support portion. The vibration diaphragm is mounted on the vibration piece. As a result, pedestals with different geometric sizes in their support portions or vibration pieces can be selectively assembled with single sized housings and vibration diaphragms to fabricate sensors with different frequency sensibilities at a low manufacturing cost.
    Type: Application
    Filed: April 6, 2012
    Publication date: July 18, 2013
    Inventors: I-MIN LIN, Ching-Tsan Lin, You-Chong Li
  • Publication number: 20120125668
    Abstract: A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 24, 2012
    Applicant: XINTEC INC.
    Inventors: Yi-Ming CHANG, I-Min Lin, Po-Shen Lin