Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A toilet seat heating device is installed between a toilet cover and a bowl to provide a warming function when people use the toilet. The toilet seat heating device includes a base plate which is provided with a carbon fiber on the hotline, an upper seat and a cooling fin which is provided between the base plate and the upper seat. An upper side of the base plate is provided with an annular groove into which the carbon fiber on the hotline is provided to contact with the cooling fin. When the carbon fiber on the hotline is energized, the cooling fin can quickly absorb heat energy of the carbon fiber on the hotline and then conduct the heat energy upward to the upper seat, thereby providing a warm and comfortable toilet seat.

Abstract: An electrical heating wire containing carbon fiber includes a heating unit and an insulation sleeve cladding on the heating unit. The heating unit is a carbon fiber bundle constituted by plural carbon fiber yarns or a structure formed by wrapping, weaving or twining the carbon fiber bundle with at least one element among a glass fiber bundle, a rock fiber bundle, a ceramic fiber bundle and a DuPont Kevlar® are fiber bundle (aromatic polyamide fiber bundle). The carbon fiber yarn can be a structure with metal particles on the surface, a dual-layered structure with a metal layer or a graphite layer on the surface, or a porous structure. Accordingly, by the present invention, the thermal conductivity can be increased, the resistance can be reduced, the thermal diffusion coefficient can be increased, the weight can be reduced and the hygroscopicity can be improved, thus providing a better efficiency of electrical heating.

Abstract: A forming method of a toilet seat which is integrally formed with an embedded heating wire uses primarily a plastic material or glass fiber reinforced plastic to embed a heating wire in a toilet seat, forming the toilet seat which is integrally formed with the embedded heating wire. The toilet seat which is integrally formed with the embedded heating wire is characterized in that the said toilet seat is embedded with the heating wire which contacts with the toilet seat without leaving a gap, thereby forming the integrally formed toilet seat.

Abstract: A toilet seat heating device is installed between a toilet cover and a bowl to provide a warming function when people use the toilet. The toilet seat heating device includes a base plate which is provided with a carbon fiber on the hotline, an upper seat and a cooling fin which is provided between the base plate and the upper seat. An upper side of the base plate is provided with an annular groove into which the carbon fiber on the hotline is provided to contact with the cooling fin. When the carbon fiber on the hotline is energized, the cooling fin can quickly absorb heat energy of the carbon fiber on the hotline and then conduct the heat energy upward to the upper seat, thereby providing a warm and comfortable toilet seat.

Abstract: A basic board member includes an inner fabric member, and a gelatinous emulsion disposed on the inner fabric member, to form a gel outer layer on the inner fabric member, after the gelatinous emulsion is cured, to facilitate a low dielectric characteristic to the basic board member. The inner fabric member includes one or more fabric layers made of polytetrafluoroethylene (PTFE) material, and preferably inclined relative to each other, having an included angle of about forty five (45) degrees. An outer fabric layer may further be attached onto the fabric layer. The gelatinous emulsion may include a polytetrafluoroethylene emulsion and a coupling agent mixed and stirred together.

Abstract: A nanomaterial processing system is constructed to include a compressor adapted to compress a flow of air/liquid into a high-pressure flow of air/liquid, a material feeder adapted to feed a material into the high-pressure flow of air/liquid passing out of the compressor, enabling the fed material to be mixed with the high-pressure flow of air/liquid into a high-pressure material flow; a shunt collider adapted to shunt the high-pressure material flow into two sub-flows and to let the shunt sub-flows to collide into a collided material flow, and a high-speed cutting unit, which uses a diamond coating-coated cutting wheel to cut solid substances the collided material flow.

Abstract: A nanomaterial processing system is constructed to include a compressor adapted to compress a flow of air/liquid into a high-pressure flow of air/liquid, a material feeder adapted to feed a material into the high-pressure flow of air/liquid passing out of the compressor, enabling the fed material to be mixed with the high-pressure flow of air/liquid into a high-pressure material flow; a shunt collider adapted to shunt the high-pressure material flow into two sub-flows and to let the shunt sub-flows to collide into a collided material flow, and a high-speed cutting unit, which uses a diamond coating-coated cutting wheel to cut solid substances the collided material flow.

Abstract: An IC card expansion slot assembly comprised of a rectangular housing formed of a bottom shell and a top cover, a PC board fastened inside the bottom shell, an IC card expansion slot mounted on the PC board and aligned with an insertion slot on the front panel of the housing to receive an IC card type hard diskdrive, the PC board having an extension with an electrical connector adapted to insert into the IC card expansion slot on a mobile computer for permitting an IC card type hard diskdrive to be electrically connected to the mobile computer to increase its hard diskdrive memory capacity.

Abstract: A sliding hard disk drive mounting hardware includes a sliding box inserted in a recessed chamber on a computer mainframe and releasably locked in place through tenon-and-mortise joints to hold a hard disk drive for permitting the i/o port of the hard disk drive to be electrically connected to the master board of the computer mainframe through an interference elimination circuit board and an interface circuit board. A LED indicator is turned on by means of the control of a control card as the hard disk drive is installed to produce a signal of low potential, or turned off as the hard disk drive is not installed.