Patents by Inventor I-Shun Wang

I-Shun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10466199
    Abstract: A biosensor device includes a substrate, a sensing transistor, an isolation layer and a main interface layer. The sensing transistor is formed on the substrate and including a bottom gate structure, a top gate structure and a semiconductor layer disposed between the bottom gate structure and the top gate structure. The bottom gate structure is electrically connected to the top gate structure. The isolation layer is formed on the sensing transistor for covering the sensing transistor, and includes a first opening. The main interface layer is disposed in the first opening for receiving biomolecules to be sensed. The main interface layer is electrically connected to the top gate structure.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: November 5, 2019
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Chih-Ting Lin, Shey-Shi Lu, Yu-Hao Chen, Sheng-Yeh Chou, I-Shun Wang, Che-Wei Huang, Pei-Wen Yen
  • Publication number: 20170184541
    Abstract: A biosensor device includes a substrate, a sensing transistor, an isolation layer and a main interface layer. The sensing transistor is formed on the substrate and including a bottom gate structure, a top gate structure and a semiconductor layer disposed between the bottom gate structure and the top gate structure. The bottom gate structure is electrically connected to the top gate structure. The isolation layer is formed on the sensing transistor for covering the sensing transistor, and includes a first opening. The main interface layer is disposed in the first opening for receiving biomolecules to be sensed. The main interface layer is electrically connected to the top gate structure.
    Type: Application
    Filed: December 28, 2016
    Publication date: June 29, 2017
    Inventors: Chih-Ting LIN, Shey-Shi LU, Yu-Hao CHEN, Sheng-Yeh CHOU, I-Shun WANG, Che-Wei HUANG, Pei-Wen YEN
  • Publication number: 20150308696
    Abstract: A support pad for a stove grate includes an outer coat made by resilient material. The outer coat includes an insertion and a base. The insertion has a ridge extending from the outside thereof. The insertion is inserted through one of the through holes of the grate and the ridge contacts against the inside of the through hole. A main part is located in the outer coat and made by metal. The main part has an upright plate and a bottom plate. The upright plate is located within the insertion and has an engaging portion. The bottom plate is located within the base. The engaging portion includes multiple teeth to urge the insertion to be securely engaged with the through hole.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 29, 2015
    Applicant: Jih Shin Enamel Co., Ltd.
    Inventor: I-Shun Wang
  • Patent number: 8741679
    Abstract: The NH3 plasma treatment by remote plasma is firstly proposed to replace the covalent bonding process during surface modification procedure that for amine bond generation.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: June 3, 2014
    Assignee: Chang Gung University
    Inventors: Chao-Sung Lai, Jau-Song Yu, Yu-Sun Chang, Po-Lung Yang, Tseng-Fu Lu, Yi-Ting Lin, Wen-Yu Chuang, Ting-Chun Yu, I-Shun Wang, Jyh-Ping Chen, Chou Chien
  • Publication number: 20120322167
    Abstract: The NH3 plasma treatment by remote plasma is firstly proposed to replace the covalent bonding process during surface modification procedure that for amine bond generation.
    Type: Application
    Filed: May 8, 2012
    Publication date: December 20, 2012
    Applicant: Chang Gung University
    Inventors: Chao-Sung LAI, Jau-Song Yu, Yu-Sun Chang, Po-Lung Yang, Tseng-Fu Lu, Yi-Ting Lin, Wen-Yu Chuang, Ting-Chun Yu, I-Shun Wang, Jyh-Ping Chen, Chou Chien
  • Patent number: D710723
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: August 12, 2014
    Assignee: Jih Shin Enamel Co., Ltd.
    Inventor: I-Shun Wang