Abstract: A cooling apparatus for graphic cards is used for two graphic cards that are disposed in parallel. There is a receiving space between the two graphic cards. The cooling apparatus for graphic cards includes a first base, a first cooler, a plurality of first heat pipes, a second base, a second cooler, and a plurality of second heat pipes. The first base is located on the first heat-emitting element of the first graphic card. One end of the first cooling pipe extends through the first base, and the second end of the first cooling pipe extends through the first cooler. The second base is located on the second heat-emitting element of the second graphic card. Thereby, the cooling apparatus for graphic cards can be applied to a plurality of graphic cards. The heat is simultaneously exhausted for both cards and the space is reduced.

Abstract: A heat exchange structure is connected to a dual water cooling system and a heat dissipating apparatus has the heat exchange structure. The heat exchange structure includes a box as a main body, and the box includes a first cavity and a second cavity. The first cavity and the second cavity are interconnected with separate water cooling systems, wherein the first cavity includes a first chamber, and the first cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to the first chamber. The second cavity includes a second chamber, and the second cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to a second chamber. A heat conducting plate is disposed at a position that connects the first cavity and the second cavity for providing a heat conducting path of the first cavity and the second cavity.

Abstract: A liquid cooling system has a thermoelectric cooling module, a heat dissipating assembly, a water block and multiple flexible guide tubes with liquid flows inside. The thermoelectric cooling module has a cold surface and a hot surface. The water block has a contacting surface attached to a processor of a computer. The guide tubes are mounted between the thermoelectric cooling module, the heat dissipating assembly and the water block. With the thermoelectric cooling module, the liquid cooling system can cool a processor of computer hardware with high efficiency, and is able to dissipate extraordinary heat generated by the processor.