Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: The present disclosure provides a circuit board with an embedded chip, which includes a dielectric layer, a first circuit layer, a chip, a conductive connector, and an insulating protection layer. The first circuit layer includes at least one first trace in the dielectric layer. The chip is in the dielectric layer and adjacent to the first trace, where the chip includes a plurality of chip pads at an upper surface of the chip. The conductive connector is on the upper surface of the chip and on the first circuit layer, where a lower surface of the conductive connector contacts at least one chip pad of the chip pads and an upper surface of the first trace. The insulating protection layer is on the chip, the first circuit layer, and the conductive connector, where the insulating protection layer contacts the upper surface of the chip.

Abstract: Monoclonal antibodies against human Mac-1 are provided. These antibodies can bind to different states of Mac-1 so as to alter the biofunctions of Mac-1. These antibodies can modulate Th1/Th2 cytokine secretions by TLR-activated immune cells and can be used for the treatments of diseases related to acute and chronic inflammatory disorders, such as infectious diseases, and cancers.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: An electronic device includes a first body, a second body and a third body. The first body includes a processing unit. The second body includes an input unit and is pivoted to an end of the first body. The third body includes a display unit and is pivoted to another end of the first body. When the third body is closed to the first body and the first body is closed to the second body, the electronic device is in a folded state. When the first body is expanded from the second body with a first predetermined angle, the third body is expanded from the first body with a second predetermined angle, such that the electronic device is in an operation state. When the electronic device is in the operation state, the third body is supported away from the second body by the first body.

Abstract: An electronic device is provided, including first and second bodies, a processing module, a touch display panel, and at least one sensing unit. The second body is rotatably connected to the first body. The processing module is disposed in the first body or the second body. The touch display panel is disposed on the second body, is coupled to the processing module, and has a main display part, and first and second display parts. The sensing unit is disposed in the first body or the second body and coupled to the processing module. When the sensing unit detects the first and second bodies are folded relative to each other, the processing module is switched to a second mode, wherein in the second mode, the main display part is activated, the first display part and the second display part are adapted to operate synchronously or operate individually.

Abstract: A hinge module is provided, including a positioning assembly, a first shaft, a second shaft, a first bracket, a second bracket, and a switching assembly. The first shaft has a first rotating part and a first installing part. The first rotating part is rotatably disposed through the positioning assembly. The second shaft has a second rotating part and a second installing part. The second rotating part is rotatably disposed through the positioning assembly. The first bracket is disposed on the first installing part of the first shaft. The second bracket is disposed on the second installing part of the second shaft. The switching assembly is movably disposed in the positioning assembly and abuts between the first shaft and the second shaft. The hinge module is adapted to switch between a closed state, a first unfolded state, and a second unfolded state.

Abstract: An electronic device is provided, including first and second bodies, a processing module, a touch display panel, and at least one sensing unit. The second body is rotatably connected to the first body. The processing module is disposed in the first body or the second body. The touch display panel is disposed on the second body, is coupled to the processing module, and has a main display part, and first and second display parts. The sensing unit is disposed in the first body or the second body and coupled to the processing module. When the sensing unit detects the first and second bodies are folded relative to each other, the processing module is switched to a first mode. In the first mode, the first and second display parts are adapted to synchronously display or individually display a first message, a second message, or a third message.

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

Abstract: A hinge module is provided, including a positioning assembly, a first shaft, a second shaft, a first bracket, a second bracket, and a switching assembly. The first shaft has a first rotating part and a first installing part. The first rotating part is rotatably disposed through the positioning assembly. The second shaft has a second rotating part and a second installing part. The second rotating part is rotatably disposed through the positioning assembly. The first bracket is disposed on the first installing part of the first shaft. The second bracket is disposed on the second installing part of the second shaft. The switching assembly is movably disposed in the positioning assembly and abuts between the first shaft and the second shaft. The hinge module is adapted to switch between a closed state, a first unfolded state, and a second unfolded state.

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

Abstract: An electronic device is provided, including first and second bodies, a processing module, a touch display panel, and at least one sensing unit. The second body is rotatably connected to the first body. The processing module is disposed in the first body or the second body. The touch display panel is disposed on the second body, is coupled to the processing module, and has a main display part, and first and second display parts. The sensing unit is disposed in the first body or the second body and coupled to the processing module. When the sensing unit detects the first and second bodies are folded relative to each other, the processing module is switched to a first mode. In the first mode, the first and second display parts are adapted to synchronously display or individually display a first message, a second message, or a third message.

Abstract: An air cleaning device using water as a filter comprises a water tank, a water pump, a pressure equalizer and air-inhale tubes. The water tank includes an accommodation space for containing water, air inlets and air outlets. A cover hoods the water tank and has a water storage tank and air inlets. The water pump is disposed inside the water tank and connected with the pressure equalizer. Jet pipes of the pressure equalizer respectively interconnect with the air inlets through the air-inhale tubes. The water pump sucks the water in the accommodation space. Through the air-inhale tubes, the jet pipes inhale air in a jet fashion from exterior of the air inlets disposed in multiple directions. The air cleaning device can filter out the impurities in the air and fast clean the air of a large space. The present invention uses water as the filter and favors environmental protection.

Abstract: An air cleaning device using water as a filter comprises a water tank, a water pump, a pressure equalizer and air-inhale tubes. The water tank includes an accommodation space for containing water, air inlets and air outlets. A cover hoods the water tank and has a water storage tank and air inlets. The water pump is disposed inside the water tank and connected with the pressure equalizer. Jet pipes of the pressure equalizer respectively interconnect with the air inlets through the air-inhale tubes. The water pump sucks the water in the accommodation space. Through the air-inhale tubes, the jet pipes inhale air in a jet fashion from exterior of the air inlets disposed in multiple directions. The air cleaning device can filter out the impurities in the air and fast clean the air of a large space. The present invention uses water as the filter and favors environmental protection.

Abstract: A manufacturing method for a circuit structure embedded with an electronic device including the following steps is provided. A first dielectric material is provided. At least one electronic device is disposed on the first dielectric material. A second dielectric material is laminated on the first dielectric material, and two conductive materials are disposed on the first dielectric material and the second dielectric material respectively, such that the electronic device is embedded between the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are respectively located between the electronic device and the corresponding conductive material, and the first dielectric material, the second dielectric material, the electronic device and the two conductive materials form a core board. An inner-layer circuit is formed on the core board, and the inner-layer circuit is connected with the electronic device.

Abstract: A driving assistant method for an electric vehicle is provided with the following steps. When the electric vehicle is started up, a battery energy safe driving region is calculated and displayed. The battery energy safe driving region is updated dynamically according to vehicle information. The vehicle information includes battery information of the electric vehicle.

Abstract: A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first insulating protection layer having a chip mounting area for the chip to be mounted thereon via the active surface thereof; a plurality of connection columns disposed in the first insulating protection layer at positions corresponding to the electrode pads and electrically connected to the electrode pads via solder bumps; an encapsulant formed on one surface of the first insulating protection layer having the chip mounted thereon for encapsulating the chip; and a built-up structure formed on the other surface of the first insulating protection layer and the connection columns. Due to the bending resistance of the encapuslant, the warpage of the built-up structure is prevented.

Abstract: A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first insulating protection layer having a chip mounting area for the chip to be mounted thereon via the active surface thereof; a plurality of connection columns disposed in the first insulating protection layer at positions corresponding to the electrode pads and electrically connected to the electrode pads via solder bumps; an encapsulant formed on one surface of the first insulating protection layer having the chip mounted thereon for encapsulating the chip; and a built-up structure formed on the other surface of the first insulating protection layer and the connection columns. Due to the bending resistance of the encapuslant, the warpage of the built-up structure is prevented.