Abstract: A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate via structure is formed over a substrate. The first stacked die package structure is over the through substrate via structure, wherein the first stacked die package structure comprises a plurality of memory dies. The underfill layer is over the first stacked die package structure. the package layer is over the underfill layer, wherein the package layer has a protruding portion that extends below a top surface of the through substrate via structure.

Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.

Abstract: A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a region of a glass-based article that includes a compressive stress layer extending from a surface to a depth of compression to form a glass-based article with multiple thickness regions, and then ion exchanging the glass-based article to form a stress profile in the thinner region that has a maximum central tension that is less than a maximum central tension of a stress profile of the thicker region. The glass articles produced by the method are also provided.

Abstract: A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a region of a glass-based article that includes a compressive stress layer extending from a surface to a depth of compression to form a glass-based article with multiple thickness regions, and then ion exchanging the glass-based article to form a stress profile in the thinner region that has a maximum central tension that is less than a maximum central tension of a stress profile of the thicker region. The glass articles produced by the method are also provided.

Abstract: A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a region of a glass-based article that includes a compressive stress layer extending from a surface to a depth of compression to form a glass-based article with multiple thickness regions, and then ion exchanging the glass-based article to form a stress profile in the thinner region that has a maximum central tension that is less than a maximum central tension of a stress profile of the thicker region. The glass articles produced by the method are also provided.

Abstract: A method for achieving segmentation of a picture according to one aspect of the present invention comprises: determining a first foreground of a picture based on a predetermined mask; applying Gaussian Mixture Models with weighted data (GMM-WD) to the first foreground to generate a second foreground; determining a first background of the picture based on the second foreground; applying the GMM-WD to the first background to generate a second background; and determining an unknown region based on the second background and the second foreground.

Abstract: A method for achieving segmentation of a picture according to one aspect of the present invention comprises: determining a first foreground of a picture based on a predetermined mask; applying Gaussian Mixture Models with weighted data (GMM-WD) to the first foreground to generate a second foreground; determining a first background of the picture based on the second foreground; applying the GMM-WD to the first background to generate a second background; and determining an unknown region based on the second background and the second foreground.

Abstract: A system and method for touch detection and a touch-responsive surface are provided. According to one embodiment, a “virtual” touch-sensitive surface in is provided in that a plurality of transmitter-sensor devices receive and calculate a touch by detecting position and movement on a touch surface. The touch surface includes a planar surface; a first transmitter-sensor device located at a first position proximate to the planar surface and a second transmitter-sensor device located at a second position proximate to the planar surface, wherein each of the transmitter-sensors includes a light beam emitter and a scanning micromirror to reflect the light beam across the planar surface. A processing unit is in operable communication with the first transmitter-sensor device and the second transmitter-sensor device, and the processing unit is configured to calculate the position of a touch on the planar surface based on one or more times of refection of the light beams.

Abstract: A semiconductor package system which includes a base circuit board, a semiconductor package mounted on the base circuit board, and a heat dissipation component having a first contacting area for making a first connection with an upper portion of the semiconductor package and a second contacting area for making a second connection with the base circuit board is disclosed. A method of improving heat dissipation of a semiconductor package is also disclosed.