Patents by Inventor I Ting Tsai

I Ting Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11161782
    Abstract: A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a region of a glass-based article that includes a compressive stress layer extending from a surface to a depth of compression to form a glass-based article with multiple thickness regions, and then ion exchanging the glass-based article to form a stress profile in the thinner region that has a maximum central tension that is less than a maximum central tension of a stress profile of the thicker region. The glass articles produced by the method are also provided.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: November 2, 2021
    Assignee: Corning Incorporated
    Inventors: Chai Hsin Kuang, Sheng Min Lin, I-Ting Tsai
  • Publication number: 20210230057
    Abstract: A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a region of a glass-based article that includes a compressive stress layer extending from a surface to a depth of compression to form a glass-based article with multiple thickness regions, and then ion exchanging the glass-based article to form a stress profile in the thinner region that has a maximum central tension that is less than a maximum central tension of a stress profile of the thicker region. The glass articles produced by the method are also provided.
    Type: Application
    Filed: April 16, 2021
    Publication date: July 29, 2021
    Inventors: Chai Hsin Kuang, Sheng Min Lin, I-Ting Tsai
  • Publication number: 20190161401
    Abstract: A method of producing glass-based articles having sections of different thicknesses is provided, where a maximum central tension in a thinner section is less than that of a thicker section. The method includes reducing the thickness of a region of a glass-based article that includes a compressive stress layer extending from a surface to a depth of compression to form a glass-based article with multiple thickness regions, and then ion exchanging the glass-based article to form a stress profile in the thinner region that has a maximum central tension that is less than a maximum central tension of a stress profile of the thicker region. The glass articles produced by the method are also provided.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Inventors: Chai Hsin Kuang, Sheng Min Lin, I-Ting Tsai
  • Patent number: 8306333
    Abstract: A method for achieving segmentation of a picture according to one aspect of the present invention comprises: determining a first foreground of a picture based on a predetermined mask; applying Gaussian Mixture Models with weighted data (GMM-WD) to the first foreground to generate a second foreground; determining a first background of the picture based on the second foreground; applying the GMM-WD to the first background to generate a second background; and determining an unknown region based on the second background and the second foreground.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: November 6, 2012
    Assignee: National Tsing Hua University
    Inventors: Shang Hong Lai, I Ting Tsai, Szu Hao Huang
  • Publication number: 20110150337
    Abstract: A method for achieving segmentation of a picture according to one aspect of the present invention comprises: determining a first foreground of a picture based on a predetermined mask; applying Gaussian Mixture Models with weighted data (GMM-WD) to the first foreground to generate a second foreground; determining a first background of the picture based on the second foreground; applying the GMM-WD to the first background to generate a second background; and determining an unknown region based on the second background and the second foreground.
    Type: Application
    Filed: December 17, 2009
    Publication date: June 23, 2011
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: SHANG HONG LAI, I TING TSAI, SZU HAO HUANG
  • Publication number: 20100170725
    Abstract: A system and method for touch detection and a touch-responsive surface are provided. According to one embodiment, a “virtual” touch-sensitive surface in is provided in that a plurality of transmitter-sensor devices receive and calculate a touch by detecting position and movement on a touch surface. The touch surface includes a planar surface; a first transmitter-sensor device located at a first position proximate to the planar surface and a second transmitter-sensor device located at a second position proximate to the planar surface, wherein each of the transmitter-sensors includes a light beam emitter and a scanning micromirror to reflect the light beam across the planar surface. A processing unit is in operable communication with the first transmitter-sensor device and the second transmitter-sensor device, and the processing unit is configured to calculate the position of a touch on the planar surface based on one or more times of refection of the light beams.
    Type: Application
    Filed: January 6, 2009
    Publication date: July 8, 2010
    Applicant: Hong Kong Applied Science and Technology Research Institute
    Inventors: Amy Mei Sze Au-Yeung, I-Ting Tsai, Shou Lung Chen, Chen Jung Tsai
  • Publication number: 20080001277
    Abstract: A semiconductor package system which includes a base circuit board, a semiconductor package mounted on the base circuit board, and a heat dissipation component having a first contacting area for making a first connection with an upper portion of the semiconductor package and a second contacting area for making a second connection with the base circuit board is disclosed. A method of improving heat dissipation of a semiconductor package is also disclosed.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Tsrong Yi Wen, I-Ting Tsai, Enboa Wu