Abstract: A resource block (RB)-based multicarrier modulation (MCM) transmitter and receiver structure for spectral agile systems are disclosed. The transmitter and the receiver are capable of sharing opportunistically available and non-contiguous channels with other users. The RB-MCM partitions the available spectrum, contiguous or non-contiguous, into multiple RBs (same or different sizes), applies a baseband MCM or single carrier modulation, or coded single carrier or multicarrier schemes in each RB with a type of spectral leakage reduction technique, and applies RB modulation for each RB to modulate the signal from baseband to the frequency band of that RB. At the receiver, the received signal may be filtered and RB demodulation may be applied to put each RB signal in baseband and a baseband multicarrier or single carrier or coded single carrier or coded multicarrier demodulation may be applied to each RB signal. Different RBs may use different modulation schemes.

Abstract: A buoyancy-driven kinetic energy generating apparatus includes a base having a tank. A rotor includes a rotor body rotatably received in the tank. At least one float telescopes relative to the rotor body to a rotating axis of the rotor body while the rotor body rotates. A telescopic movement control module is mounted in the tank and controls the telescopic movement of the at least one float. A method generates kinetic energy by using the buoyancy-driven kinetic energy generating apparatus. The method includes filling a liquid into the tank to provide the rotor body with a pre-buoyancy and controlling the at least one float to telescope relative to the rotor body, causing a change in local buoyancy of the rotor body to imbalance the rotor body and to cause rotation of the rotor body about the rotating axis.

Abstract: A method and apparatus for implementing spatial processing with unequal modulation and coding schemes (MCSs) or stream-dependent MCSs are disclosed. Input data may be parsed into a plurality of data streams, and spatial processing is performed on the data streams to generate a plurality of spatial streams. An MCS for each data stream is selected independently. The spatial streams are transmitted via multiple transmit antennas. At least one of the techniques of space time block coding (STBC), space frequency block coding (SFBC), quasi-orthogonal Alamouti coding, time reversed space time block coding, linear spatial processing and cyclic delay diversity (CDD) may be performed on the data/spatial streams. An antennal mapping matrix may then be applied to the spatial streams. The spatial streams are transmitted via multiple transmit antennas. The MCS for each data stream may be determined based on a signal-to-noise ratio of each spatial stream associated with the data stream.

Abstract: Systems and methods for providing orthogonal frequency division multiplexing-offset quadrature amplitude modulation (OFDM-OQAM) structure may be disclosed. For example, a synthesis filter bank (SFB) and/or an analysis filter bank (AFB) for a filter length may be derived. The filter length may be odd. Additionally, the AFB may be an inverse discrete Fourier transform (IDFT)-based AFB and/or a discrete Fourier transform (DFT)-based AFB.

Abstract: A method and apparatus for implementing spatial processing with unequal modulation and coding schemes (MCSs) or stream-dependent MCSs are disclosed. Input data may be parsed into a plurality of data streams, and spatial processing is performed on the data streams to generate a plurality of spatial streams. An MCS for each data stream is selected independently. The spatial streams are transmitted via multiple transmit antennas. At least one of the techniques of space time block coding (STBC), space frequency block coding (SFBC), quasi-orthogonal Alamouti coding, time reversed space time block coding, linear spatial processing and cyclic delay diversity (CDD) may be performed on the data/spatial streams. An antennal mapping matrix may then be applied to the spatial streams. The spatial streams are transmitted via multiple transmit antennas. The MCS for each data stream may be determined based on a signal-to-noise ratio of each spatial stream associated with the data stream.

Abstract: A method and apparatus for implementing spatial processing with unequal modulation and coding schemes (MCSs) or stream-dependent MCSs are disclosed. Input data may be parsed into a plurality of data streams, and spatial processing is performed on the data streams to generate a plurality of spatial streams. An MCS for each data stream is selected independently. The spatial streams are transmitted via multiple transmit antennas. At least one of the techniques of space time block coding (STBC), space frequency block coding (SFBC), quasi-orthogonal Alamouti coding, time reversed space time block coding, linear spatial processing and cyclic delay diversity (CDD) may be performed on the data/spatial streams. An antennal mapping matrix may then be applied to the spatial streams. The spatial streams are transmitted via multiple transmit antennas. The MCS for each data stream may be determined based on a signal-to-noise ratio of each spatial stream associated with the data stream.

Abstract: A system-in-package (SiP) package is provided. In one embodiment, the SiP package comprises a substrate having a first surface and a second surface opposite the first surface, the substrate having a set of bond wire studs on bond pads formed on the second surface thereof; a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of solder bumps; an underfill material disposed between the first semiconductor chip and the substrate, encapsulating the solder bumps; a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip; and a set of bond wires electrically coupled from the second semiconductor chip to the set of bond wire studs on the substrate.

Abstract: In an orthogonal frequency division multiplexed (OFDM) multiple-in multiple-out (MIMO) wireless communication system, a method for correcting sampler clock frequency offset in a receiver comprises acquiring the frequency offset and symbol timing in a received signal by the receiver. The estimated value of a fractional offset is computed, and a correction in the frequency domain based upon the estimated value of the fractional offset is performed.

Abstract: In a wireless communication system, a method and apparatus for noise estimation of a received OFDM communication signal, wherein the signal comprises a data frame with a preamble having at least one long training field (LTF) containing two substantially similar OFDM symbols, comprise examining the LTF for substantially similar OFDM symbols. The noise power in the signal is estimated and the received signal power is measured. The signal to noise ratio is calculated and the signal power is determined by subtracting the noise power from the signal noise.

Abstract: A system-in-package (SiP) package is provided. In one embodiment, the SiP package comprises a substrate having a first surface and a second surface opposite the first surface, the substrate having a set of bond wire studs on bond pads formed on the second surface thereof; a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of solder bumps; an underfill material disposed between the first semiconductor chip and the substrate, encapsulating the solder bumps; a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip; and a set of bond wires electrically coupled from the second semiconductor chip to the set of bond wire studs on the substrate.

Abstract: A system-in-package (SiP) package is provided. In one embodiment, the SiP package comprises a substrate having a first surface and a second surface opposite the first surface, the substrate having a set of bond wire studs on bond pads formed on the second surface thereof; a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of solder bumps; an underfill material disposed between the first semiconductor chip and the substrate, encapsulating the solder bumps; a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip; and a set of bond wires electrically coupled from the second semiconductor chip to the set of bond wire studs on the substrate.

Abstract: An improved via arrangement for a bonding pad structure is disclosed comprising an array of vias surrounded by a line via. The line via provides a barrier to cracks in the dielectric layer encompassing the via array. Although cracks are able to spread relatively unhindered between the vias of the via array, they are blocked by the line via and thus can not spread to neighboring regions of the chip or wafer. The line via can be provided in a variety of shapes and dimensions, to suit a desired application. Additionally, due to its substantially uninterrupted length, the line via provides added strength to the bond pad.

Abstract: Solder bump structures for semiconductor device packaging is provided. In one embodiment, a semiconductor device comprises a substrate having a bond pad and a first passivation layer formed thereabove, the first passivation layer having an opening therein exposing a portion of the bond pad. A metal pad layer is formed on a portion of the bond pad, wherein the metal pad layer contacts the bond pad. A second passivation layer is formed above the metal pad layer, the second passivation layer having an opening therein exposing a portion of the metal pad layer. A patterned and etched polyimide layer is formed on a portion of the metal pad layer and a portion of the second passivation layer. A conductive layer is formed above a portion of the etched polyimide layer and a portion of the metal pad layer, wherein the conductive layer contacts the metal pad layer. A conductive bump structure is connected to the conductive layer.

Abstract: A method and apparatus perform I/Q imbalance estimation and compensation using synchronization signals in LTE systems. Primary and secondary synchronization signals (P-SCH and S-SCH), which carry synchronization information, are embedded in each LTE frame, and are used for receiver I/Q imbalance estimation. Additionally, the performance may be significantly improved by optimally selecting the training data in I/Q imbalance estimation.

Abstract: Methods and apparatus are disclosed for improving the frame error rate performance of a multi-input multi-output orthogonal frequency division modulation (MIMO-OFDM) system with a limited-bandwidth feedback channel is disclosed. Successive interference cancellation (SIC) is used to improve MIMO-OFDM system performance gain with cyclic redundancy check (CRC) and convolutional codes (CC). Additional performance gains are obtained when MIMO channel state information (CSI) is available at the transmitting unit.

Abstract: An electronic device comprises a housing, a pillar and a fixing unit. The housing comprises a side-wall, an opening and a first positioning portion, wherein the opening is formed on the side-wall, and the first positioning portion is disposed in the housing corresponding to the side-wall. The fixing unit comprises an arm, and a second positioning portion, wherein the pillar is disposed on the arm, the second positioning portion is disposed on an end of the arm, the pillar is inserted into the opening to prevent the fixing unit from moving in a first direction and a second direction, the first direction perpendicular to the second direction, and when the fixing unit is in a fixing orientation, the second positioning portion contacts the first positioning portion, the first positioning portion prevents the fixing unit from moving in a third direction perpendicular to the first and second directions.

Abstract: An apparatus for wave energy harnessing includes at least one slide shaft, a buoyant unit, an energy-transmitting unit, and a rotate unit. The slide shaft is firmly mounted on the seabed. The buoyant unit is movably engaged with the slide shaft and has a reservoir and an adjusting board, so as to control the vertical position of the buoyant unit relative to sea level. The energy-transmitting unit is mounted on the buoyant unit. The rotate unit rotatably engages with the energy-transmitting unit and connects with an energy-transfonning unit through a transmission shaft. Thereby, the buoyant unit is driven by waves to vertically slide along the slide shaft, the energy-transmitting unit rotates the transmission shaft of the rotate unit, and, thus, the energy-transforming unit generates power.

Abstract: An apparatus for wave energy harnessing includes at least one slide shaft, a buoyant unit, an energy-transmitting unit, and a rotate unit. Said at least one slide shaft is firmly mounted on seabed. The buoyant unit is movably engaged with the slide shaft and has a reservoir and an adjusting board, so as to control the vertical position of the buoyant unit relative to sea level. The energy-transmitting unit is mounted on the buoyant unit. And the rotate unit rotatably engages with the energy-transmitting unit and connects with an energy-transforming unit through a transmission shaft. Thereby, the buoyant unit is driven by wave to vertically slide along the at least one slide shaft, the energy-transmitting unit rotates the transmission shaft of the rotate unit and thus the energy-transforming unit generates power.

Abstract: A system-in-package (SiP) package is provided. In one embodiment, the SiP package comprises a substrate having a first surface and a second surface opposite the first surface, the substrate having a set of bond wire studs on bond pads formed on the second surface thereof; a first semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the first semiconductor chip is mounted to the second surface of the substrate by means of solder bumps; an underfill material disposed between the first semiconductor chip and the substrate, encapsulating the solder bumps; a second semiconductor chip having a first surface and a second surface opposite the first surface, wherein the first surface of the second semiconductor chip is mounted to the second surface of the first semiconductor chip; and a set of bond wires electrically coupled from the second semiconductor chip to the set of bond wire studs on the substrate.

Abstract: Solder bump structures for semiconductor device packaging is provided. In one embodiment, a semiconductor device comprises a substrate having a bond pad and a first passivation layer formed thereabove, the first passivation layer having an opening therein exposing a portion of the bond pad. A metal pad layer is formed on a portion of the bond pad, wherein the metal pad layer contacts the bond pad. A second passivation layer is formed above the metal pad layer, the second passivation layer having an opening therein exposing a portion of the metal pad layer. A patterned and etched polyimide layer is formed on a portion of the metal pad layer and a portion of the second passivation layer. A conductive layer is formed above a portion of the etched polyimide layer and a portion of the metal pad layer, wherein the conductive layer contacts the metal pad layer. A conductive bump structure is connected to the conductive layer.