Patents by Inventor I-Tsao LIAO

I-Tsao LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10183378
    Abstract: A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: January 22, 2019
    Assignee: KINIK COMPANY
    Inventors: Jui-Lin Chou, I-Tsao Liao, Chia-Feng Chiu, Jen Feng Chen, Sheng Kai Hong
  • Publication number: 20180354095
    Abstract: A grinding tool includes a substrate and a plurality of abrasive particles. The substrate has a first and a second surface and a plurality of holes, each of the holes extending through the substrate and respectively having a first and a second opening on the first and second surface, the second opening being larger than the first opening. The abrasive particles are respectively disposed in the holes and attached to the substrate via a plurality of adhesive portions, each of the abrasive particles having a tip protruding outward from the first surface and a remaining part covered with one of the adhesive portions inside the corresponding hole, wherein the first openings of the holes are smaller than the abrasive particles, and the abrasive particles are respectively retained in the holes. Moreover, embodiments described herein include a method of fabricating a grinding tool.
    Type: Application
    Filed: June 8, 2018
    Publication date: December 13, 2018
    Applicant: Kinik Company
    Inventors: Jui-Lin CHOU, I-Tsao LIAO, Tsung-Yu YANG
  • Publication number: 20170246724
    Abstract: A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another.
    Type: Application
    Filed: May 15, 2017
    Publication date: August 31, 2017
    Applicant: KINIK COMPANY
    Inventors: Jui-Lin CHOU, I-Tsao LIAO, Chia-Feng CHIU, Jen Feng CHEN, Sheng Kai HONG
  • Patent number: 9687961
    Abstract: A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another. In some embodiments, methods of fabricating a grinding tool are also described.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: June 27, 2017
    Assignee: KINIK COMPANY
    Inventors: Jui-Lin Chou, I-Tsao Liao, Chia-Feng Chiu, Jen Feng Chen, Sheng Kai Hong
  • Patent number: 9616550
    Abstract: A grinding tool includes a rigid support body and a carrier substrate. The carrier substrate is attached to the support body, and is supported by the support body. Two opposing surfaces of the carrier substrate respectively define a working surface and a non-working surface. A plurality of first abrasive particles are affixed on the working surface, and a plurality of second abrasive particles are affixed on the non-working surface. The first abrasive particles have a first average size, and the second abrasive particles have a second average size smaller than the first average size. The carrier substrate is attached to the support body at the non-working surface. Moreover, a method of manufacturing the grinding tool is described herein.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: April 11, 2017
    Assignee: Kinik Company
    Inventors: Jui-Lin Chou, I-Tsao Liao, Chia-Feng Chiu
  • Publication number: 20160176017
    Abstract: A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another. In some embodiments, methods of fabricating a grinding tool are also described.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 23, 2016
    Applicant: KINIK COMPANY
    Inventors: Jui-Lin CHOU, I-Tsao LIAO, Chia-Feng CHIU, Jen Feng CHEN, Sheng Kai HONG
  • Publication number: 20160114465
    Abstract: A grinding tool includes a rigid support body and a carrier substrate. The carrier substrate is attached to the support body, and is supported by the support body. Two opposing surfaces of the carrier substrate respectively define a working surface and a non-working surface. A plurality of first abrasive particles are affixed on the working surface, and a plurality of second abrasive particles are affixed on the non-working surface. The first abrasive particles have a first average size, and the second abrasive particles have a second average size smaller than the first average size. The carrier substrate is attached to the support body at the non-working surface. Moreover, a method of manufacturing the grinding tool is described herein.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 28, 2016
    Applicant: KINIK COMPANY
    Inventors: Jui-Lin CHOU, I-Tsao LIAO, Chia-Feng CHIU
  • Publication number: 20150231759
    Abstract: The present invention relates to a chemical mechanical polishing conditioner with high performance, comprising a substrate; a binding layer disposed on the substrate; and a plurality of abrasive particles fixed directly on the substrate by the binding layer, or each abrasive particle disposed on a metal fixing seat and the substrate have a plurality of blind holes and a plurality of through holes, so that the metal fixing seats are installed into the blind holes or the through holes, and the metal fixing seat fixed on the substrate by the binding layer; wherein the abrasive particles are treated by a surface processing treatment to make the abrasive particles have specific cutting edge angles, crystal structures, tip heights, or tip orientations. Therefore, the present invention can control the profile of each abrasive particle to accomplish the best polishing performance.
    Type: Application
    Filed: January 12, 2015
    Publication date: August 20, 2015
    Inventors: Jui-Lin CHOU, Chia-Chun WANG, I-Tsao LIAO, Chia-Feng CHIU, Wen-Jen LIAO
  • Publication number: 20150202735
    Abstract: The present invention relates to a chemical mechanical polishing conditioner with optimal abrasive exposing rate, comprising a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein each abrasive particle has an abrasive exposing rate which is ¼ to ¾ of particle sizes of the abrasive particles and is measured by a height measuring device. Therefore, the chemical mechanical polishing conditioner with optimal abrasive exposing rate of the present invention can control the exposing rate of the abrasive particles to improve the cut rate of the conditioner.
    Type: Application
    Filed: November 12, 2014
    Publication date: July 23, 2015
    Inventor: I-Tsao LIAO