Patents by Inventor I. Wang
I. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145421Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.Type: ApplicationFiled: October 27, 2023Publication date: May 2, 2024Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
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Publication number: 20240145298Abstract: Structures with doping free connections and methods of fabrication are provided. An exemplary structure includes a substrate; a first region of a first conductivity type formed in the substrate; an overlying layer located over the substrate; a well region of a second conductivity type formed in the overlying layer; a conductive plug laterally adjacent to the well region and extending through the overlying layer to electrically contact with the first region; and a passivation layer located between the conductive plug and the well region.Type: ApplicationFiled: February 17, 2023Publication date: May 2, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Min Huang, Tzu-Jui Wang, Jung-I Lin, Hung-Chang Chien, Kuan-Chieh Huang, Tzu-Hsuan Hsu, Chen-Jong Wang
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Patent number: 11969845Abstract: In a quick measurement module provided by the present invention, a first distance sensing unit and a second distance sensing unit are provided individually on a movable seat, so that when the movable seat is displaced along a linear shifting axis, the first distance sensing unit senses the distance from the first reference plane, and meanwhile, the second distance sensing unit senses the distance from the second reference plane, so as to sense the linearity accuracy in movement of the movable seat with respect to the first reference plane and the second reference plane. The first reference plane and the second reference plane are spaced apart by an angle other than a right angle, so that the linearity accuracy in movement in the two different planes, such as the horizontal linearity accuracy and vertical linearity accuracy, of the movable seat can be obtained through sensing.Type: GrantFiled: February 18, 2020Date of Patent: April 30, 2024Assignee: HIWIN MIKROSYSTEM CORP.Inventors: Chen Yi Wang, Zong Ting Sie, Kou I Szu
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Publication number: 20240135861Abstract: The present disclosure provides a display apparatus including an LED array. The display apparatus comprises a light emitting diode (LED) array, a power source, a controller, a PWM switch, and a current source module. The controller is configured to generate a control signal for controlling a first LED column during a scan period. The PWM switch is electrically connected between the first LED column and a second power level. The current source module is electrically connected between the first LED column and the second power level. The current source module is configured to provide a current flow with multiple levels. The PWM switch is controlled based on a first portion of the control signal, and the amount of the current flow provided by the current source module in the scan period depends on a second portion of the control signal.Type: ApplicationFiled: October 23, 2022Publication date: April 25, 2024Inventors: Tsun-I WANG, Ching-Chun WU, Chia-Liang YANG
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Patent number: 11955379Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.Type: GrantFiled: September 15, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai
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Publication number: 20240113201Abstract: Methods and structures for modulating an inner spacer profile include providing a fin having an epitaxial layer stack including a plurality of semiconductor channel layers interposed by a plurality of dummy layers. In some embodiments, the method further includes removing the plurality of dummy layers to form a first gap between adjacent semiconductor channel layers of the plurality of semiconductor channel layers. Thereafter, in some examples, the method includes conformally depositing a dielectric layer to substantially fill the first gap between the adjacent semiconductor channel layers. In some cases, the method further includes etching exposed lateral surfaces of the dielectric layer to form an etched-back dielectric layer that defines substantially V-shaped recesses. In some embodiments, the method further includes forming a substantially V-shaped inner spacer within the substantially V-shaped recesses.Type: ApplicationFiled: January 25, 2023Publication date: April 4, 2024Inventors: Chih-Ching WANG, Wei-Yang LEE, Bo-Yu LAI, Chung-I YANG, Sung-En LIN
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Patent number: 11945877Abstract: Antibodies, antigen-binding fragments and polypeptides that bind to HER2 are disclosed, as well as nucleic acids and vectors encoding the same. Also provided are cells comprising the antibodies, antigen-binding fragments, polypeptides, nucleic acids and vectors, methods of making such molecules, and the use of such molecules for therapeutic applications.Type: GrantFiled: February 12, 2019Date of Patent: April 2, 2024Assignee: Agency for Science, Technology and ResearchInventors: Cheng-I Wang, Lionel Jianrong Low, Angeline Goh, Sandy Wen-Hsin Lee
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Patent number: 11949001Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.Type: GrantFiled: March 21, 2022Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Ching Wang, Chung-I Yang, Jon-Hsu Ho, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
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Publication number: 20240100147Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).Type: ApplicationFiled: November 3, 2023Publication date: March 28, 2024Inventors: Chi-Huey WONG, Hsin-Yu LIAO, Shih-Chi WANG, Yi-An KO, Kuo-I LIN, Che MA, Ting-Jen CHENG
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Publication number: 20240103617Abstract: Gaze enrollment, including displaying an enrollment progress user indicator, animating movement of user interface elements, changing the appearances of user interface elements, and/or moving a user interface element over time, enable a computer system to more accurately track the gaze of a user of the computer system.Type: ApplicationFiled: September 21, 2023Publication date: March 28, 2024Inventors: Giancarlo YERKES, Adam L. AMADIO, Amy E. DEDONATO, Kirsty KEATCH, Stephen O. LEMAY, Israel PASTRANA VICENTE, Danielle M. PRICE, William A. SORRENTINO, III, Lynn I. STREJA, Hugo D. VERWEIJ, Hana Z. WANG
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Patent number: 11940388Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).Type: GrantFiled: March 16, 2018Date of Patent: March 26, 2024Assignee: IXENSOR CO., LTD.Inventors: Yenyu Chen, An Cheng Chang, Tai I Chen, Su Tung Yang, Chih Jung Hsu, Chun Cheng Lin, Min Han Wang, Shih Hao Chiu
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Patent number: 11918641Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).Type: GrantFiled: May 7, 2021Date of Patent: March 5, 2024Assignee: ACADEMIA SINICAInventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
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Publication number: 20240072082Abstract: A boron (B) layer may be formed as a passivation layer in a recess in which a vertical transfer gate is to be formed. The recess may then be filled with a gate electrode of the vertical transfer gate over the passivation layer (and/or one or more intervening layers) to form the vertical transfer gate. The passivation layer may be formed in the recess by epitaxial growth. The use of epitaxy to grow the passivation layer enables precise control over the profile, uniformity, and boron concentration in the passivation layer. Moreover, the use of epitaxy to grow the passivation layer may reduce the diffusion length of the passivation layer into the substrate of the pixel sensor, which provides increased area in the pixel sensor for the photodiode.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Yu-Hung CHENG, Tzu-Jui WANG, Ching I. LI
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Patent number: 11914989Abstract: Techniques for specifying and implementing a software application targeted for execution on a multiprocessor array (MPA). The MPA may include a plurality of processing elements, supporting memory, and a high bandwidth interconnection network (IN), communicatively coupling the plurality of processing elements and supporting memory. In some embodiments, software code may specify one or more cell definitions that include: program instructions executable to perform a function and one or more language constructs. The software code may further instantiate first, second, and third cell instances, each of which is an instantiation of one of the one or more cell definitions, where the instantiation includes configuration of the one or more language constructs such that: the first and second cell instances communicate via respective communication ports and the first and second cell instances are included in the third cell instance.Type: GrantFiled: October 28, 2021Date of Patent: February 27, 2024Assignee: Coherent Logix, IncorporatedInventors: Stephen E. Lim, Viet N. Ngo, Jeffrey M. Nicholson, John Mark Beardslee, Teng-I Wang, Zhong Qing Shang, Michael Lyle Purnell
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Patent number: 11912761Abstract: The present invention is directed to antigen binding proteins and in particular to IL-1? antigen binding proteins. The present invention further provides compositions comprising the antigen binding proteins, use of the antigen binding proteins and methods for production.Type: GrantFiled: January 15, 2021Date of Patent: February 27, 2024Assignee: Agency for Science, Technology and ResearchInventors: Cheng-I Wang, Angeline Goh, Siok Ping Yeo, Alessandra Rosa Mortellaro, Subhra Kumar Biswas, Florent Ginhoux, Pingyu Zhong
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Patent number: 11916022Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.Type: GrantFiled: June 7, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
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Publication number: 20240052046Abstract: Antigen binding molecules capable of binding to CDI22 and/or common y? chain (CDI32) are disclosed herein. Also disclosed are compositions comprising such antigen binding molecules, and uses and methods using the same.Type: ApplicationFiled: June 29, 2023Publication date: February 15, 2024Applicants: Agency for Science, Technology and Research, Euchloe Bio Pte. Ltd.Inventors: Peter Brauer, John Edward Connolly, Richard Hopkins, Junyun Lai, Jianrong Lionel Low, Kar Wai Tan, Cheng-I Wang, Siok Ping Yeo
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Publication number: 20240045317Abstract: A method includes forming a reflective multilayer over a substrate; depositing a first capping layer over the reflective multilayer, wherein the first capping layer is made of a ruthenium-containing material or a chromium-containing material; performing a treatment to the first capping layer to introduce nitrogen or fluorine into the first capping layer; forming an absorption layer over the first capping layer; and patterning the absorption layer.Type: ApplicationFiled: August 2, 2022Publication date: February 8, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsin-Chang LEE, Ping-Hsun LIN, Pei-Cheng HSU, Hsuan-I WANG, Hung-Yi TSAI, Bo-Wei SHIH, Ta-Cheng LIEN
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Patent number: 11891432Abstract: The disclosure provides anti-DENV antibodies having a cross-reactivity to ZIKV and methods of making and using the same. The anti-DENV antibodies have uses that include treating or preventing ZIKV infection.Type: GrantFiled: March 15, 2019Date of Patent: February 6, 2024Assignees: Chugai Seiyaku Kabushiki Kaisha, Agency for Science, Technology & ResearchInventors: Katja Fink, Cheng-I Wang, Lisa Fong Poh Ng, Laurent Renia, Zenjiro Sampei, Xing'er Christine Xoo
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Patent number: D1015848Type: GrantFiled: May 6, 2022Date of Patent: February 27, 2024Assignee: Taiwan Fu Hsing Industrial Co., Ltd.Inventor: Jui-I Wang