Patents by Inventor I Zeng Lee

I Zeng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array semiconductor package with improved strength and electric performance and method for making the same
    Patent number: 6534852
    Abstract: Disclosed are metal reinforced layers disposed at the upper and lower surfaces of the thin substrate to reinforce the strength of the thin substrate. With reinforced strength, the thin substrate is not susceptible to deform due to temperature fluctuation during packaging process, and thus the warpage for the semiconductor package is significantly eliminated. According to another aspect of the present invention, the metal reinforced layer at the lower surface of the thin substrate is functioned as a ground plane for the ball grid array (BGA) semiconductor package for better grounding effect. The present invention provides an optimal design for the return current path and impedance matching control. Besides, in high frequency application, the metal reinforced layer also can reduce the noise and cross talk among the signal lines of the ball grid array (BGA) semiconductor package.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: March 18, 2003
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung Lin, I Zeng Lee, Su Tao, Kun-Ching Chen