Abstract: A touch sensor may include a digital resistive touch (DRT) sensor architecture that is substantially free of air gaps. The DRT touch sensor may include a layer of force-sensitive resistor (FSR) material on an array of row and column electrodes. The electrodes may be formed on a substantially transparent substrate. Near the intersection of each row and column, one or more thin transparent patterned conductive bridges may be situated above the FSR. The conductive bridges may be configured for electrical connection with row and column electrodes when force is applied to the conductive bridge or surface of the touch sensor. Some touch sensors may include both DRT and projected capacitive touch (PCT) functionality.

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.

Abstract: This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.

Abstract: Use of a compliant, elastomeric layer between upper and lower substrates of the combination sensor can increase the sensitivity to applied pressure or force from a stylus, while increasing the lateral resolution for a given sensel pitch. The elastomeric material may have an index of refraction that is substantially similar to that of the upper and lower substrates. The elastomeric material may include open regions for the inclusion of force-sensitive resistors. With careful selection of the elastomeric and FSR materials, the loss of transmissivity that can accompany air gaps can be minimized.

Abstract: Fabrication methods for combined sensor devices include substantially transparent substrates and materials to increase the optical performance of underlying displays. A substantially transparent elastomeric material may be disposed between the substantially transparent substrates. Some fabrication processes utilize flexible substrates for at least a portion of the sensor device, and lend themselves to roll-to-roll processing for low cost.

Abstract: This disclosure provides systems, methods and apparatus implementations of a display device with a cover glass apparatus that serves as a single or multi-touch sensor, as a handwriting (or note capture) input device, and in some configurations as a fingerprint sensor. Sensor functionality and resolution can be tailored to specific locations on the cover glass apparatus. In some such implementations, the area in which the fingerprint sensing elements are located may provide not only fingerprint detection, but also handwriting and touch functionality. In some other implementations, the fingerprint sensor may be segregated into a separate, high-resolution zone that only provides fingerprint functionality.

Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.

Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, the combined sensor device may enable a single touchscreen to perform additional functions such as handwriting input and fingerprint recognition. In some implementations, these multiple features allow increased security through user authentication, and allow better capture of handwriting and a more interactive approach to user interfaces. A handheld mobile device such as a cell phone with the combined sensor device can enable an array of applications, such as using the mobile device as a gateway for user authentication to enable transactions and physical access; using the handwriting input function for signature recognition and transmittal for transaction applications; and/or using the handwriting input feature to automatically capture notes and other documents of students in an academic setting or employees in a corporate setting.

Abstract: A separate control system may be configured for a combined sensor device. Alternatively, at least part of the control system may be included in another device, such as a processor of a mobile device. Software for handwriting, touch and fingerprint detection may be included in the control system. Low, medium and high resolution may be obtained with a single combined sensor device by scanning a subset of the sensels, or by aggregating lines or columns. Power consumption may be reduced by aggregating sensor pixels (or rows or columns) electrically using the controller, so that they perform as a low power small array until higher resolution with a larger array is needed. Power consumption may be reduced by turning off portions or all of the sensor device, turning off parts of the control system, and/or employing first-level screening at a reduced frame rate.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: A device for the prophylaxis of pressure sores which comprises a liquid retained within a flexible elastomeric envelope is described. The body contacting surface of the device is a film which has a moisture vapor transmission rate of greater than 300 g/m.sup.2 /24 hr at 37.degree. C. at 100% to 10% relative humidity difference. The liquid is a viscous liquid which absorbs moisture vapor. The device is formed in the shape of the letter "U" which makes the device particularly useful for application to the sacrum. A device in which the liquid retained within the flexible envelope is a mixture of a viscous liquid and a hygroscopic material is also described.

Abstract: A device suitable for the prophylaxis of pressure sores which device comprises a gel retained within a flexible elastomeric envelope which envelope has a body contacting surface which is a film having a moisture vapor transmission rate of greater than 300 g/m.sup.2 /24 hr.sup.-1 at 37.degree. C. at 100% to 10% relative humidity difference characterized in that the device is 5 to 25 mm thick and may be worn on the body and the gel is a mobile moisture absorbing hydrophilic gel is described.