Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a transistor with a thermal plug and methods of manufacture. The structure includes: a semiconductor substrate; a gate structure over the semiconductor substrate; a source region on a first side of the gate structure; a drain region on a second side of the gate structure; and a thermal plug extending from a top side of the semiconductor substrate into an active region of the semiconductor substrate.

Abstract: Structures for a chip, as well as methods of fabricating such chip structures. The chip including a portion of a substrate, an active circuit region associated with the portion of the substrate, an interconnect structure on the active circuit region, and a crackstop extending through the interconnect structure. A groove extends through the interconnect structure to the substrate at a location exterior of the crackstop. A stress-containing layer is formed on at least a portion of the groove.

Abstract: Electrical fuses and methods for forming an electrical fuse. A semiconductor substrate is implanted to define a modified region in the semiconductor substrate. Trenches that surround the modified region and that penetrate into the semiconductor substrate to a depth greater than a depth of the modified region are formed in the modified region so as to define a fuse link of the electrical fuse. The substrate is removed from beneath the fuse link with a selective etching process that removes the semiconductor substrate with a first etch rate that is higher than a second etch rate of the modified region.

Abstract: Electrical fuses and methods for forming an electrical fuse. A semiconductor substrate is implanted to define a modified region in the semiconductor substrate. Trenches that surround the modified region and that penetrate into the semiconductor substrate to a depth greater than a depth of the modified region are formed in the modified region so as to define a fuse link of the electrical fuse. The substrate is removed from beneath the fuse link with a selective etching process that removes the semiconductor substrate with a first etch rate that is higher than a second etch rate of the modified region.

Abstract: A battery pack includes a plurality of prismatic format batteries in a stacked configuration. Flexible graphite sheet heat spreaders are interposed between adjacent prismatic batteries in the stack. A heat sink extends the length of the stack of prismatic format batteries. Both heat spreader major surfaces contact the heat sink at contact areas and thereby extend into the heat sink by at least 30 percent of the thru-thickness of the heat sink.

Abstract: A high resistivity substrate final resistance test structure, methods of manufacture and testing processes are disclosed. The test structure includes spaced apart implants extending into a high resistivity wafer in at least one kerf region of the wafer. The test structure further includes contacts in direct electrical contact to each of the spaced apart implants.

Abstract: A high resistivity substrate final resistance test structure, methods of manufacture and testing processes are disclosed. The test structure includes spaced apart implants extending into a high resistivity wafer in at least one kerf region of the wafer. The test structure further includes contacts in direct electrical contact to each of the spaced apart implants.

Abstract: A battery pack includes a plurality of prismatic format batteries in a stacked configuration. Flexible graphite sheet heat spreaders are interposed between adjacent prismatic batteries in the stack. A heat sink extends the length of the stack of prismatic format batteries. Both heat spreader major surfaces contact the heat sink at contact areas and thereby extend into the heat sink by at least 30 percent of the thru-thickness of the heat sink.

Abstract: A surface finishing and coating methodology that provides a superior looking aluminum product with acceptable corrosion performance for outdoor use. In one embodiment, a coating of high purity aluminum is applied first to an aluminum article or product via cold or thermal spray and the mechanical surface modification (e.g., polishing, buffing, brushing, etc.) is clone second. The resulting product has the desirable light weight and mechanical properties of aluminum with the chosen look and performance of the high purity aluminum coating. The aluminum product to be coated may be obtained by extrusion, forging, casting, or rolling.