Abstract: A curable resin composition contains a curable resin that comprises at least one non-aromatic epoxy compound, at least one non-aromatic oxetane compound, or a mixture thereof, one or more curing agents selected from Lewis acid:Lewis base complexes, and a cure accelerating amount of one or more anhydride compounds. A method accelerating the cure of a curable resin composition, comprising adding a cure accelerating amount of one or more anhydride compounds to a curable resin composition comprising a curable resin that comprises at least one non-aromatic epoxy compound or non-aromatic oxetane compound and a curing agent that comprises one or more Lewis acid-base complexes. The composition and method are useful in making fiber reinforced resin matrix composite articles.

Abstract: A curable resin composition contains a curable resin that comprises at least one non-aromatic epoxy compound, at least one non-aromatic oxetane compound, or a mixture thereof, one or more curing agents selected from Lewis acid:Lewis base complexes, and a cure accelerating amount of one or more anhydride compounds. A method accelerating the cure of a curable resin composition, comprising adding a cure accelerating amount of one or more anhydride compounds to a curable resin composition comprising a curable resin that comprises at least one non-aromatic epoxy compound or non-aromatic oxetane compound and a curing agent that comprises one or more Lewis acid-base complexes. The composition and method are useful in making fiber reinforced resin matrix composite articles.

Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.

Abstract: A curable resin composition containing: (a) at least one resin; and (b) curative selected from the group consisting of (i) a mixture of at least one low temperature curative and at least one high temperature curative or (ii) a curative that has a low temperature curative part and a high temperature curative part wherein the amount of the low temperature curative is sufficient to cause enough resin-curative addition reaction to effect B-staging in the full resin-curative formulation, the amount of the high temperature curative is sufficient to cause the resin to cure catalytically but insufficient to cause resin-curative addition reaction in the final cure, and the ratio of the resin (a) to the curative (b) is greater than or equal to about 5. The present composition may be used to make prepregs for automotive or aerospace application.

Abstract: A curable resin composition containing: (a) at least one resin; and (b) curative selected from the group consisting of (i) a mixture of at least one low temperature curative and at least one high temperature curative or (ii) a curative that has a low temperature curative part and a high temperature curative part wherein the amount of the low temperature curative is sufficient to cause enough resin-curative addition reaction to effect B-staging in the full resin-curative formulation, the amount of the high temperature curative is sufficient to cause the resin to cure catalytically but insufficient to cause resin-curative addition reaction in the final cure, and the ratio of the resin (a) to the curative (b) is greater than or equal to about 5. The present composition may be used to make prepregs for automotive or aerospace application.

Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.

Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.

Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.

Abstract: An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material comprising at least one adhesive polymeric resin, and one of either; a) low aspect ratio metal-coated additives present in the range 0.2 wt. % to 30 wt. % of the adhesive material; or b) discrete high aspect ratio metal-coated additives present in the range 0.2 wt. % to 25 wt. % of the adhesive material.

Abstract: An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material comprising at least one adhesive polymeric resin, and one of either; a) low aspect ratio metal-coated additives present in the range 0.2 wt. % to 30 wt. % of the adhesive material; or b) discrete high aspect ratio metal-coated additives present in the range 0.2 wt. % to 25 wt. % of the adhesive material.

Abstract: Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140° C. and 160° C. for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond.