Patents by Inventor Ian Bentley

Ian Bentley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151567
    Abstract: An example sensing and secretion bypass apparatus and an associated method of manufacturing. The sensing and secretion bypass apparatus may include an air flow sensor. The sensing and secretion bypass apparatus may further include an adapter including a chamber having a first end configured to receive an air flow and a second end connected to the air flow sensor. The air flow may include secretions. The sensing and secretion bypass apparatus may further include an elevated member disposed within the chamber proximate the second end and configured to prevent the secretions from entering the air flow sensor. The sensing and secretion bypass apparatus may further include a disposal housing in fluid communication with the chamber of the adapter and configured to collect the secretions received via the first end of the chamber.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: Rahul AVASTHI, Ian BENTLEY
  • Patent number: 11959787
    Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device may include a sensing element disposed at least partially within the housing, and a plurality of channels disposed within the housing defining a flow path configured to convey a flowing media through the flow sensing device, wherein the flow path is disposed proximate the sensing element such that at least a portion of the flowing media makes direct contact with the sensing element.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Honeywell International Inc.
    Inventors: Brian Speldrich, Jamie Speldrich, Paul Bey, Scott Beck, Ian Bentley, Steven Lowery, Richard Bishop
  • Patent number: 11906610
    Abstract: Methods, apparatuses and systems for providing offset calibration and fault monitoring are disclosed herein. An example controller component may comprise: a resistance-based bridge circuit; a signal conditioning circuit configured to condition an output of the resistance-based bridge circuit; a first diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a first branch of the resistance-based bridge circuit; and a second diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a second branch of the resistance-based bridge circuit.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: February 20, 2024
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Ian Bentley, Richard Bishop, Richard Kirkpatrick
  • Publication number: 20230358586
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Patent number: 11768116
    Abstract: Example systems, apparatuses and methods are disclosed for sensing a force applied by an external source in a fluid monitoring tube. An example system comprises a force sensing device and signal conditioning circuitry configured to be electrically coupled to the force sensing device. The example system further comprises a housing configured to enclose the force sensing device and the signal conditioning circuitry. The housing comprises a snap structure configured to attach the housing to a base plate and retain the force sensing device and the signal conditioning circuitry in the housing.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: September 26, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Richard Wade, Ian Bentley
  • Patent number: 11747184
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: September 5, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Patent number: 11650119
    Abstract: A pressure sensor includes a substrate, a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on a first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element, thus multiple pressure sensing elements being disposed on a single substrate can reduce material cost and improve the performance of the pressure sensor.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: May 16, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Lamar Floyd Ricks, Ian Bentley, Jim Cook, Josh M. Fribley
  • Publication number: 20220291322
    Abstract: Methods, apparatuses and systems for providing offset calibration and fault monitoring are disclosed herein. An example controller component may comprise: a resistance-based bridge circuit; a signal conditioning circuit configured to condition an output of the resistance-based bridge circuit; a first diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a first branch of the resistance-based bridge circuit; and a second diagnostic circuit coupled to the signal conditioning circuit configured to monitor an output of a second branch of the resistance-based bridge circuit.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 15, 2022
    Inventors: Ian Bentley, Richard Bishop, Richard Kirkpatrick
  • Publication number: 20220283007
    Abstract: Methods and apparatuses associated with flow sensing devices are provided. An example flow sensing device may include a sensing element disposed at least partially within the housing, and a plurality of channels disposed within the housing defining a flow path configured to convey a flowing media through the flow sensing device, wherein the flow path is disposed proximate the sensing element such that at least a portion of the flowing media makes direct contact with the sensing element.
    Type: Application
    Filed: March 2, 2021
    Publication date: September 8, 2022
    Inventors: Brian Speldrich, Jamie Speldrich, Paul Bey, Scott Beck, Ian Bentley, Steven Lowery, Richard Bishop
  • Patent number: 11300535
    Abstract: An apparatus for calculating a thermal conductivity of a gaseous substance is provided. The apparatus includes a substrate; a cover member disposed on the substrate, wherein the cover member comprises a flow tunnel for the gaseous substance; a flow sensing element disposed on the substrate, wherein the flow sensing element is exposed to the gaseous substance in the flow tunnel; and a pressure sensing element disposed on the substrate, wherein the pressure sensing element is exposed to the gaseous substance in the flow tunnel.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: April 12, 2022
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Richard Charles Sorenson, Steven Lowery, Ian Bentley
  • Publication number: 20220003623
    Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Inventors: Lamar Floyd Ricks, Ian Bentley, Jim Cook, Josh M. Fribley
  • Patent number: 11156521
    Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element. The pressure sensor further includes a buffer layer disposed on the first surface of the substrate such that the first pressure sensing element is disposed on the buffer layer. Multiple pressure sensing elements disposed on a single substrate for improving the performance of the pressure sensor.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: October 26, 2021
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Lamar Floyd Ricks, Ian Bentley, Jim Cook, Josh M. Fribley
  • Publication number: 20210018384
    Abstract: Example systems, apparatuses and methods are disclosed for sensing a force applied by an external source in a fluid monitoring tube. An example system comprises a force sensing device and signal conditioning circuitry configured to be electrically coupled to the force sensing device. The example system further comprises a housing configured to enclose the force sensing device and the signal conditioning circuitry. The housing comprises a snap structure configured to attach the housing to a base plate and retain the force sensing device and the signal conditioning circuitry in the housing.
    Type: Application
    Filed: October 6, 2020
    Publication date: January 21, 2021
    Inventors: Richard Wade, Ian Bentley
  • Patent number: 10890472
    Abstract: In an embodiment, a method of sensing a flow comprises performing a measurement cycle for a first period of time, powering off the at least one upstream resistive element and the at least one downstream resistive element for a second period of time, and performing another measurement cycle for a third period of time. Performing the measurement cycle comprises supplying a current to the upstream resistive element and the downstream resistive element arranged in a bridge, resistively heating the upstream resistive element and the downstream resistive element to a temperature above an ambient temperature, and detecting an imbalance in the bridge resulting from a temperature difference between the at least one upstream resistive element and the at least one downstream resistive element in response to the flow of a fluid past the flow sensor.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: January 12, 2021
    Assignee: Honeywell International Inc.
    Inventors: Craig Scott Becke, Lamar Floyd Ricks, Ian Bentley
  • Publication number: 20200370938
    Abstract: Example systems, apparatuses, and methods are disclosed sensing a flow of fluid using a thermopile-based flow sensing device. An example apparatus includes a flow sensing device comprising a heating structure having a centerline. The flow sensing device may further comprise a thermopile. At least a portion of the thermopile may be disposed over the heating structure. The thermopile may comprise a first thermocouple having a first thermocouple junction disposed upstream of the centerline of the heating structure. The thermopile may further comprise a second thermocouple having a second thermocouple junction disposed downstream of the centerline of the heating structure.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Inventors: Robert Higashi, Scott Edward Beck, Yong-Fa Wang, Ian Bentley, Bill Hoover
  • Patent number: 10837812
    Abstract: A flow sensor assembly including a top flowtube that defines an inlet port, an outlet port, and a main channel. An inlet flow channel fluidly may connect the inlet port of the flow sensor assembly to the main channel. An outlet flow channel fluidly may connect the main channel to the outlet port. The bottom flowtube may include a shroud which acts as a cover over an electronic circuit board. The shroud may eliminate a step, created by the flow sensor, to provide a continuous flow path over the sensor. The channels may be formed to utilize the entire footprint of the flow sensor assembly.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: November 17, 2020
    Assignee: HONEYWELL INTERNATIONAL INC
    Inventors: Jamie Speldrich, William Hoover, Richard C. Sorenson, Ian Bentley
  • Patent number: 10830653
    Abstract: Example systems, apparatuses and methods are disclosed for sensing a force applied by an external source in a fluid monitoring tube. An example system comprises a force sensing device and signal conditioning circuitry configured to be electrically coupled to the force sensing device. The example system further comprises a housing configured to enclose the force sensing device and the signal conditioning circuitry. The housing comprises a snap structure configured to attach the housing to a base plate and retain the force sensing device and the signal conditioning circuitry in the housing.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: November 10, 2020
    Assignee: Honeywell International Inc.
    Inventors: Richard Wade, Ian Bentley
  • Publication number: 20200319127
    Abstract: An apparatus for calculating a thermal conductivity of a gaseous substance is provided. The apparatus includes a substrate; a cover member disposed on the substrate, wherein the cover member comprises a flow tunnel for the gaseous substance; a flow sensing element disposed on the substrate, wherein the flow sensing element is exposed to the gaseous substance in the flow tunnel; and a pressure sensing element disposed on the substrate, wherein the pressure sensing element is exposed to the gaseous substance in the flow tunnel.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 8, 2020
    Inventors: Richard Charles Sorenson, Steven Lowery, Ian Bentley
  • Publication number: 20200319050
    Abstract: A pressure sensor is provided. The pressure sensor includes a substrate, and a first pressure sensing element, a second pressure sensing element, and sensor conditioning circuitry disposed on the first surface of the substrate. The sensor conditioning circuitry is electronically coupled to the first pressure sensing element and the second pressure sensing element.
    Type: Application
    Filed: April 5, 2019
    Publication date: October 8, 2020
    Inventors: Lamar Floyd Ricks, Ian Bentley, Jim Cook, Josh M. Fribley
  • Publication number: 20200309622
    Abstract: Example systems, apparatuses and methods are disclosed for sensing a force applied by an external source in a fluid monitoring tube. An example system comprises a force sensing device and signal conditioning circuitry configured to be electrically coupled to the force sensing device. The example system further comprises a housing configured to enclose the force sensing device and the signal conditioning circuitry. The housing comprises a snap structure configured to attach the housing to a base plate and retain the force sensing device and the signal conditioning circuitry in the housing.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 1, 2020
    Inventors: Richard Wade, Ian Bentley