Abstract: An apparatus and associated method for polishing a workpiece with a polishing slurry having ceria particulates and silica particulates.

Abstract: A method of polishing to reduce surface roughness of at least one surface of a glass ceramic substrate that includes an amorphous glass portion and a crystalline portion. The method comprises at least one step of polishing the surface using a polishing pad and an abrasive polishing slurry. The polishing slurry comprises a first concentration of Ceria particulates and a second concentration of Silica particulates. The amorphous glass portion and the crystalline portion of the at least one surface are polished substantially equally.

Abstract: A method for making substrates is disclosed. The method comprises providing a rod, which is made out of a substrate material and has an outside diameter substantially the same size as the outside diameter of a finished substrate and an inside diameter substantially the same size as the inside diameter of the finished substrate. The rod is cut with a multi-wire cutter to make a substrate slice substantially the same size as a finished substrate. The multi-wire cutter has wires positioned to substantially match the final thickness of the finished substrate. Additionally the cutting process is facilitated by using slurry and by providing a rocking motion between the rod and the wires of the multi-wire cutter so that the wires contact the rod in a rocking motion with respect to a normal to the center of the rod.