Abstract: A technique for attaching an optical element to a structural element is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for attaching an optical element to a structural element. Such an apparatus may comprise an optical element formed of a material having a first coefficient of thermal expansion value, a structural element formed of a material having a second coefficient of thermal expansion value, and an intermediate element formed of a material having a third coefficient of thermal expansion value that is between the first coefficient of thermal expansion value and the second coefficient of thermal expansion value. The intermediate element is disposed between the optical element and the structural element such that thermal stress between the optical element and the structural element are transferred to the intermediate element.

Abstract: A technique for packaging an optical module is disclosed. In one particular exemplary embodiment, the technique may be realized as an optical module packaging apparatus comprising an optical module having a first slip-fit engagement means, at least one support rail for supporting the optical module, and an end cap attached to the at least one support rail. The optical module packaging apparatus may also comprise an enclosure for enclosing the optical module and the at least one support rail and engaging the end cap, wherein the enclosure has a second slip-fit engagement means for engaging the first slip-fit engagement means.

Abstract: A technique for attaching an optical element to a structural element is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for attaching an optical element to a structural element. Such an apparatus may comprise an optical element formed of a material having a first coefficient of thermal expansion value, a structural element formed of a material having a second coefficient of thermal expansion value, and an intermediate element formed of a material having a third coefficient of thermal expansion value that is between the first coefficient of thermal expansion value and the second coefficient of thermal expansion value. The intermediate element is disposed between the optical element and the structural element such that thermal stress between the optical element and the structural element are transferred to the intermediate element.