Patents by Inventor Ian CORNES

Ian CORNES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of manufacturing security documents and security devices
    Patent number: 10861121
    Abstract: A method of manufacturing a security document, including: providing a polymer substrate having first and second surfaces; and: applying an array of focussing elements to the first surface of the polymer substrate across a first region; forming an image array by: providing a die form having a surface including an arrangement of raised areas and recessed areas defining the pattern; applying a first curable material to the surface of the die form so it substantially fills the recessed areas; bringing a pattern support layer in contact with the surface of the die form so it covers the recessed areas; separating the pattern support layer from the surface of the die form so the first curable material in the recessed areas is removed from the recessed areas and retained on the pattern support layer; and at least partly curing the first curable material in one or more curing steps.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: December 8, 2020
    Assignee: DE LA RUE INTERNATIONAL LIMITED
    Inventors: Brian William Holmes, John Godfrey, Ian Cornes, John O'Malley, Lawrence George Commander
  • METHODS OF MANUFACTURING SECURITY DOCUMENTS AND SECURITY DEVICES
    Publication number: 20180186166
    Abstract: A method of manufacturing a security document, including: providing a polymer substrate having first and second surfaces; and: applying an array of focussing elements to the first surface of the polymer substrate across a first region; forming an image array by: providing a die form having a surface including an arrangement of raised areas and recessed areas defining the pattern; applying a first curable material to the surface of the die form so it substantially fills the recessed areas; bringing a pattern support layer in contact with the surface of the die form so it covers the recessed areas; separating the pattern support layer from the surface of the die form so the first curable material in the recessed areas is removed from the recessed areas and retained on the pattern support layer; and at least partly curing the first curable material in one or more curing steps.
    Type: Application
    Filed: July 11, 2016
    Publication date: July 5, 2018
    Applicant: DE LA RUE INTERNATIONAL LIMITED
    Inventors: Brian William HOLMES, John GODFREY, Ian CORNES, John O'MALLEY, Lawrence George COMMANDER