Abstract: A system and method are provided for profiling a structure in an integrated circuit to determine the structural dimensions. The system comprises a processor circuit that includes a processor electrically coupled to a local interface and a memory electrically coupled to the local interface, where the local interface comprises, for example, a data bus and associated control bus. The system further comprises a critical dimension scanning electron microscope having a signal output electrically coupled to the local interface and operating logic stored on the memory and executable by the processor. The operating logic comprises logic to execute a scan of a structure in an integrated circuit using the SEM, logic to store a first derivative waveform generated from the scan in the memory, and logic to generate a profile of the structure from the first derivative waveform.

Abstract: A method for contact hole formation and inspection during integrated circuit fabrication is disclosed. The method includes defining tolerances for one or more contact hole formation processes, and then performing the formation processes to create at least one contact hole. After at least one of the formation processes is performed, a waveform is generated for the contact hole. A critical dimension (CD) and an edge width value are then generated for the contact hole from the waveform. The CD and the edge width value are then compared to the tolerances to detect and correct variations in the formation process. In a further aspect of the present invention, the edge width is compared to a predetermined limit to automatically detect contact holes having sloped sidewalls.

Abstract: A method for contact hole formation and inspection during integrated circuit fabrication is disclosed. The method includes defining tolerances for one or more contact hole formation processes, and then performing the formation processes to create at least one contact hole. After at least one of the formation processes is performed, a waveform is generated for the contact hole. A critical dimension (CD) and an edge width value are then generated for the contact hole from the waveform. The CD and the edge width value are then compared to the tolerances to detect and correct variations in the formation process. In a further aspect of the present invention, the edge width is compared to a predetermined limit to automatically detect contact holes having sloped sidewalls.

Abstract: A method for contact hole formation and inspection during integrated circuit fabrication is disclosed. The method includes defining tolerances for one or more contact hole formation processes, and then performing the formation processes to create at least one contact hole. After at least one of the formation processes is performed, a waveform is generated for the contact hole. A critical dimension (CD) and an edge width value are then generated for the contact hole from the waveform. The CD and the edge width value are then compared to the tolerances to detect and correct variations in the formation process. In a further aspect of the present invention, the edge width is compared to a predetermined limit to automatically detect contact holes having sloped sidewalls.

Abstract: Air flow control means comprising a substantially annular member having an outer surface and an inner surface, a port formed through said member and connecting said surfaces, a flexible, resilient band having at least one passage therethrough, said band surrounding and slidable on said outer surface and the shape of said outer surface being such that said band follows a path that is spaced from said outer surface in at least two spaced-apart regions thereof and contacts said outer surface in at least two further regions thereof, one of said further regions being the region of said port, the distortion of said band being such that said band is pulled into sealing engagement with said outer surface in the region of said port.